Electronics Forum: electronics (Page 5328 of 7890)

Re: Conductor width tolerances

Electronics Forum | Tue Nov 09 11:32:32 EST 1999 | Dave F

Wolfgang: "Our desire is to get what we design" ... Wanting to get what you ask for ... ummm sounds like a risky proposition!!! ;-) Two things: 1 Go to the Hadco site and get their "boiler-plate." Use it and some of the Earl Moon specs in the SMTn

Re: Conductor width tolerances

Electronics Forum | Wed Nov 10 12:13:53 EST 1999 | Wolfgang Busko

That�s what we consider to be practical if the 20% were the worst case we see but the reality looks different. By chance we get a -20%, sometimes worse, sometimes a "good" 10%, rarely does it hit the nominal value and never it�s a +%. In short: It lo

Breaking scored boards, breaking components.

Electronics Forum | Mon Nov 08 11:01:12 EST 1999 | Brian Larson

We are leaving 12-18 thousands material when scoring. Several components are cracking during depanelization. The pizza cutter machines out there are either too expensive or too slow to solve our problem. I am looking for a magical solution. In case

Re: Breaking scored boards, breaking components.

Electronics Forum | Mon Nov 08 19:10:10 EST 1999 | Brian W.

Oh boy, does that bring back memories!!!!! You are most likely breaking components when the board is flexed during separation. Any components perpendicular to the score are candidates for mechanical stress. We overcame the problem by making our ow

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:09:55 EST 1999 | Dave F

Steve: Continuing with Dan�s thinking, generally, "poor release" (paste hanging-up in the stencil holes) could have three main (or combination of) causes: 1 Equipment: Stencil is too thick. Specifically, your 0.006 should be OK, providing you don�

Re: paste release from stencil, and volume calculation

Electronics Forum | Mon Nov 15 12:13:41 EST 1999 | Dave F

Steve: There are guidelines for determining if your aperture has the correct proportions to the foil thickness. Maybe that�s what you�re looking for: 1 Aspect ratio = aperture width/foil thickness Chemically etched SB GT 1.5 Laser cut SB GT 1.2

Re: paste release from stencil - recommendations

Electronics Forum | Sun Nov 21 13:48:16 EST 1999 | Steve Thomas

We're going to 5 mil foil from 6 mil, with a 10 mil aperture, radiused corners. Supposedly going to traps. from right angles, but who knows? We've got temp. controlled at ~73F, but no RH control. We are going to also try out a more humidity toleran

Re: paste release from stencil - results

Electronics Forum | Sat Nov 27 10:16:38 EST 1999 | Steve Thomas

The new design resulted in much better release characteristics. We are quite satisfied. By the way, he says he can cut dead nuts 90 degree walls on the apertures, or traps. I didn't ask what the wall angle was, nor have I seen any recommendations,

SMTnet Format

Electronics Forum | Fri Nov 05 19:48:41 EST 1999 | Todd

I really like SMTnet and the forum. However, I do not like the new format of the SMTnet because when you click on a response, you can not see the original question. Also, when you click on the latest response, you can not see all of the other respons

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.


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