Electronics Forum | Fri Nov 05 12:38:07 EST 1999 | Rich Cary
We are looking for some sealed (pressurized?) flux tanks with low qty. warning for use with our Tamura spray flux machines. I have heard that a company named "Binks" has made similar tanks for other companies, but when I search on the net for them I
Electronics Forum | Thu Nov 04 13:53:12 EST 1999 | Clifford Peaslee
Eric, You can connect NT systems together with little problem, using ethernet network cards with twisted pair cables and a hub. The only expense is the NT operating systems. NT also has a personal web server, so you can have your own Intranet. For y
Electronics Forum | Thu Nov 04 14:13:34 EST 1999 | John Thorup
Hi Tim It sort of depends on the solder alloy being used and the particular assemblies being soldered. If you are using the usual 63/37 alloy I would consider 500 to be a bit warm unless the assembly required it. Some alloys would require a higher
Electronics Forum | Tue Nov 09 10:35:02 EST 1999 | WilDaly
Tim, I try to get 2-3 degrees C/sec (bottomside) rise on my boards through wavesolder. I like to get the topside to about 90-95 degrees C, but this is the optimum temp for the flux that I am using. To fast of a slope and you will burn your flux of
Electronics Forum | Mon Nov 08 15:10:56 EST 1999 | John Thorup
Well Keith, I certainly overestimated this community's desire to voice its feelings about the recent departures and the general state of SMTnet over the last several weeks. I suppose it is for the best that we just get on with it. Like most busy pr
Electronics Forum | Thu Nov 04 13:45:29 EST 1999 | Scott Cook
Hi Chris. Can't specifically address optos, but I have spec'd RH requirements and Temp requirements for new facilities I helped design for manufacturing here in FL (humidity center of the universe). For an overall benefit, I considered the potential
Electronics Forum | Thu Nov 04 07:53:45 EST 1999 | Chad Notebaert
Sounds like you have a component problem! I say this because you say the sodler is flowing away from the components (leads I assume) This sounds like none wetting of the component. Do a solderability test on the parts. Take the parts and dip the lead
Electronics Forum | Sat Nov 06 10:00:11 EST 1999 | Robert Oertner
If you are talking about reflowing surfacemount on the solder side of the assembly, that is accomplished by gluing the smt components to the bottom of the board. I recomend that you use a chip wave in conjuction with the normal wave to get the best r
Electronics Forum | Wed Nov 03 03:26:38 EST 1999 | Wes
We have Siemens S-20 machine whose other gantry occasionally missmounts all its components in Y-direction(approx. 1/2 mm ). Most of the missmounts happens when there is a lot of 0603 or 0805s (B-side glue boards). Gantry picks up the components OK bu
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
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