Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe
Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.
Electronics Forum | Wed Oct 09 12:29:14 EDT 2002 | ppcbs
We have been encountering black pad contamination on gold plated boards mainly affecting BGA components during assembly. This problem has been noticed with many of our customers that are using an array of fab vendors. Does anyone have a solution fo
Electronics Forum | Wed Jan 15 19:27:43 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Wed Jan 15 19:27:44 EST 2003 | praveen
Grainy finish of the solder joint also caused by higher reflow temp.So far we have observed grainy structure in case of gold plated board.
Electronics Forum | Wed Jul 09 15:56:14 EDT 2003 | Matt Kehoe
Hi Dave, Hmmm, pix F2? Do you meran figure 2 or second picture? The second picture is the bare board before printing. Gold plated pads. Is that what you mean? mk
Electronics Forum | Fri Sep 30 08:30:23 EDT 2005 | CLampron
http://www.filtranmicro.com/plating.html This might help define what to look for for problems. Hope this helps Chris
Electronics Forum | Thu May 18 09:40:08 EDT 2006 | russ
Good post WML! you helped a lot!, Chunks brings up good point. Are there vias that can be shorted by this component being slightly misaligned? When reworking there could be residual solder or even flux that has shorted the pads or component, etc.
Electronics Forum | Mon Mar 29 14:32:01 EDT 2010 | isd_jwendell
The board in the test "used an electroless nickel/immersion gold (ENIG) finish." If you are not using ENIG plating on your PCBs then you may not suffer from the same issue.
Electronics Forum | Thu Sep 05 23:32:29 EDT 2013 | winson16
This connector was designed with gold flash plating and the lead's surface was become dull and some black mark was observed on the contact surface.
Electronics Forum | Tue Sep 16 17:03:34 EDT 2014 | rangarajd
We have an issue with solder wicking up the leads/ inside terminations on an SMT connector. The solder coverage is sometimes over 50% of the connectors inside pin length. The terminations are gold plated. Is there an IPC spec for acceptability? Plea
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