Electronics Forum | Sun May 21 05:54:04 EDT 2000 | Sal
Currently manufacturing double-sided PCMCIA cards with a nickel/gold finish, which are 0.0235thou in thickness, using surface mount carriers. Problem we are seeing is when building the densely populated side on the second pass we are seeing lifting o
Electronics Forum | Thu May 18 22:00:38 EDT 2000 | Dean
...ahh....memory lane. 10 years ago I worked on a project for a customer who needed a low cost, high volume board for RFID tags for cows (yes, moo). These boards were 0.50 inch in diameter, 50 per panel, double sided SMT punch style fabs. 300,000 b
Electronics Forum | Sat Mar 25 10:13:18 EST 2000 | Robert Hutton-Squire
I am assembling a board with 2 x ALTERA FineLine PBGA devices. (256-pin and 100-pin) These devices have: surface pad size = 0.41mm (16) ball size = 0.48mm (18.9) ball pitch = 1.0mm (40) For my FIRST attempt I screen printed a fine pitch water solub
Electronics Forum | Mon Mar 27 20:48:25 EST 2000 | Dave F
Robert: Howya doin' bud? You say "BGA Shorting!!!" I say "Too Much Solder!!!" So, earlier comments about aperture design are appropriate, make good points, and I think we both agree that improvements could be made in your stencil design, but I'm
Electronics Forum | Tue Apr 17 09:38:04 EDT 2001 | CAL
With some help from our good Friends at Agilent Technologies our RF Lab includes testing up to 100GHz. Equipment includes Vector network analyzer, signal analyzer, dual channel power meter, noise filter meter, advanced impedance analyzer (including
Electronics Forum | Wed Apr 25 16:08:24 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:09:45 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Wed Apr 25 16:12:18 EDT 2001 | jmills
We build a product that requires a lithium battery. There is a Smt Battery clip soldered onto two gold pads on a FR4 PCB. The battery is forced by two little clips punched out to provided downward pressure in the battery holder, enabling the lithium
Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
