Electronics Forum: stencil (Page 536 of 572)

Re: bare board problem

Electronics Forum | Thu Jun 17 19:40:11 EDT 1999 | Scott Cook

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: bare board problem

Electronics Forum | Thu Jun 17 19:40:27 EDT 1999 | Scott Cook

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: bare board problem

Electronics Forum | Thu Jun 17 19:41:29 EDT 1999 | Scott Cook

| | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads.

Re: quoting smt

Electronics Forum | Wed Jun 09 17:53:06 EDT 1999 | Tom B.

| I am interested in seeing how some of you quote smt work. Currently we quote off a bom without component packages known then look in data books to find out what type of component they are. This job will be mine soon but i really believe there is a

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 11:31:27 EDT 1999 | Tony

| I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole." The

Re: Intrusive reflow..from the bottom..????

Electronics Forum | Fri May 21 04:03:46 EDT 1999 | Joe Manzur

John, Were doing an intrusive reflow process on a single sided board, where all the conventional parts are on the "top" of the board. Due to the nature of the board, and the kind of componets on it, we couldn't wave solder it. To keep it contai

Re: uBGA's

Electronics Forum | Fri May 14 18:29:26 EDT 1999 | Earl Moon

| Hi Guys, | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | So, any of you folks who have already experi

Re: uBGA's

Electronics Forum | Tue May 18 03:17:50 EDT 1999 | Philip B

| | Hi Guys, | | | | I am going to be graced with the good luck of processing microBGA's in the near future. A bit of a step forward from printing 20-mil pitch and wave soldering 0805's, wouldn't you say? | | | | So, any of you folks who have alre

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon

| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using

Re: Lifted Leads on Fine pitch QFP's

Electronics Forum | Mon Apr 19 17:33:17 EDT 1999 | Tuffty

25 PPM)! | | | | 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? | | | | 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compe


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