Electronics Forum: lead (Page 536 of 789)

Electroless Tin Plating

Electronics Forum | Fri Aug 20 11:24:54 EDT 1999 | Chuck B.

I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. Can any one tell me what I have to change in my SMT process (paste, reflow, etc) If any? I ran one P.C.Board and I

Re: Component solderabilty

Electronics Forum | Mon Aug 16 16:46:47 EDT 1999 | Mark Thaler

| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u

Re: Component solderabilty

Electronics Forum | Mon Aug 23 11:36:22 EDT 1999 | Phil B

| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u

Re: Reworking Glued Components

Electronics Forum | Tue Aug 10 11:12:27 EDT 1999 | Steve_S

| Folk's, | | I'm looking for some helpful suggestions for reworking wave soldered bottomside components that have been glued. | I'm not a fan of the twist and break approach and as some of them either have a double dot or a slot configuration this

Re: solder mask

Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian

Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve

Re: DIP using IR Reflow

Electronics Forum | Thu Aug 05 08:04:32 EDT 1999 | Peter Barton

| Hi , | | Could DIP package ( PTH) run through IR Reflow instead of wave soldering? | | Will there be any reliability impact on this package. | | Thanks | | Jack | | Jack, The dip component package material and the packaging process is the sa

Re: Uploading/Downloading Issues

Electronics Forum | Wed Jul 14 10:30:00 EDT 1999 | Clifford Peaslee

Yes, it may have been because of that. It was before we extended the file size to 1.44 meg also. I'll try to contact him to update that listing. Thanks, Cliff | I tried to download Ed Smith's paper titled "Lead Free - a push in the wrong direction

Re: Uploading/Downloading Issues

Electronics Forum | Sun Sep 05 11:22:37 EDT 1999 | Peter

| Yes, it may have been because of that. It was before we extended the file size to 1.44 meg also. I'll try to contact him to update that listing. | | Thanks, | Cliff | | | | I tried to download Ed Smith's paper titled "Lead Free - a push in the w

Re: PTH Cut Form Equipment

Electronics Forum | Tue Jul 13 14:36:55 EDT 1999 | JohnW

| I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick. |

Re: Straddle mount connector

Electronics Forum | Sat Jul 10 01:45:45 EDT 1999 | Scott

| Do you have experience with reflow process of a straddle mount connector on a 1.6 mm PCB ? | Connector have more than 200 pins | | What is the process ? | | Thanks | Depends on the connector... For connectors that have pre-applied solder such as


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