Electronics Forum | Tue Mar 15 08:02:36 EDT 2011 | davef
Yes, you can reflow solder SMT parts with pads designed for wave soldering [including 1206] providing that you design your stencil apertures properly. It's a momma, poppa, baby bear situation. * Wave solder sized apertures will put too much paste on
Electronics Forum | Fri Mar 25 10:50:01 EDT 2011 | grahamcooper22
3 deg / sec) then the flux can slump from the paste and solder is carried with it off the pad and will form balls. Finally, are your pcbs dry ? Pass a bare one through the reflow oven before you print any paste on it, let it cool and then process as
Electronics Forum | Fri Jun 10 13:04:04 EDT 2011 | spitkis2
Any suggestions as to what can cause a PBGA's corner to warp down during installation process on a rework system? A couple solder balls bridge at the corner. It appears at the pin 1 corner where the metal indicator of a BGA is exposed. I am wonder
Electronics Forum | Wed Aug 10 15:45:49 EDT 2011 | franxsmt
Maybe I was not clear in my original post. So we have boards that have SMD components on one side and TH components on the opposite side. We want to assemble the boards using our SMT and Wave lines. Now the problem is that if we solder the SMD firs
Electronics Forum | Fri Sep 16 05:29:34 EDT 2011 | jacki
This looks like a flux problem to me. I would > check the specific gravity of the flux. Also > check the thermal profile of th e wave solder > process. Hi Mosborne Thanks for your sharing. But, we use the same flux and wave profile for other pr
Electronics Forum | Mon Sep 12 10:41:50 EDT 2011 | processmxli
Hi All We have run SMT process with SnPb but we’re installing some lead free components like capacitors and resistor lead free. After the reflow oven all components have good appearance with solder join sheen. But the lead free components the solde
Electronics Forum | Mon Oct 03 15:13:00 EDT 2011 | tombstonesmt
It sounds to me that it's a heat transfer issue. The solder is only bonding to the lead on not the barrel correct? Does your selective solder equipment have any type of heating source? Can you "dwell" on that particular joint? On some of our products
Electronics Forum | Mon Oct 10 14:03:07 EDT 2011 | adp23
I have a few questions regarding Solder products being UL Listed or Recognized. I am aware that UL does test solder material (conductive material) using the UL 746 standard. However, i would like to know if UL actually recognizes the conductive mater
Electronics Forum | Tue Dec 13 15:00:31 EST 2011 | davef
Contaminating lead-free solder connections with lead is generally a bad idea, but that's not what you plan. You plan to add tin to your tin-lead solder connection. We don't think there is a significant problem for most applications. Adding tin will
Electronics Forum | Mon Mar 19 22:09:38 EDT 2012 | davef
J-STD-003B prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes utilizing either tin/lead or lead-free solders. This standard is
