Electronics Forum | Mon Feb 01 16:40:45 EST 1999 | Dave Waddick
I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product is
Electronics Forum | Sun Jan 31 01:20:22 EST 1999 | M. Faisal
| Can anyone suggest a good 2D bar-code traceability software package? | Dear Charles: Panasonic Factory Automation has a wide range of CIM Software products that offer various tracability functions like component-panel tracability. I will be glad
Electronics Forum | Tue Feb 02 10:56:53 EST 1999 | Justin Medernach
| Would anyone have experience or information on where I could find pad geometry for tantalum capacitors that can be surface or plated thru hole mounted. | Yup, Check out IPC-782. That's got all the info on land geometries that you'd be looking f
Electronics Forum | Wed Jan 27 19:42:34 EST 1999 | parag palshikar
i am working with the noclean process and getting white residues on the bottomside of the board probably due to the wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperature a
Electronics Forum | Thu Jan 28 08:42:43 EST 1999 | Dave F
| i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated temperatu
Electronics Forum | Wed Jan 27 19:52:05 EST 1999 | Wayne Bracy
| How ESD will be effected by painting the legs of the work stations. Any names of suppliers? | Ali: We represent GWS work benches and their line of ESD workstations include baked on esd paint on the frames plus esd work tops. You can contact G
Electronics Forum | Fri Jan 29 17:49:47 EST 1999 | smd
| Dave: | | The problem is always the cost.....also it is required to properly connect the work bench and top to the grounding system. | | With most installations what we find is after a year or so, people have moved the benches around and the grou
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Wed Jan 27 11:42:50 EST 1999 | John Zisa
| hi, | i am working towards developing a no-clean process for a customer at contract manufacturing facility. the assemblies have gold fingers on them. these are masked to prevent from any damage to them during reflow soldering. the earlier proces
Electronics Forum | Mon Jan 25 13:56:45 EST 1999 | Parvez Patel
Chang Hong while developing our CSP rework process, we found a temperature spread of about 130C at a distance of approx 150 mils from the component edge. our nozzle had about 20 mils clearance from all sides of the component being reworked. depending
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