Electronics Forum | Thu Aug 08 10:58:18 EDT 2002 | Tom Gervascio
I'm interested in sharing any information on bumping of LAnd Grid Array (i.e. QFN) packages. due to PCB contraints, it's not possible to stencil paste onto sites for QFNs. That lead to a lot of experimentation with bumping of 6 mm QFN packages.In sum
Electronics Forum | Wed Mar 27 01:06:12 EST 2002 | ianchan
Hi Guys, We are using two types of support Jigs for our PCB boards, during the paste printing, chip shooter, and IC mounting. The two types of support Jigs are : 1) "self-fabricated" aluminium support Blocks 2) "off shelf purchased" support Pins T
Electronics Forum | Mon Apr 15 21:55:46 EDT 2002 | ianchan
Hi Clark, Out of curiousity and in the name of learning new stuff, can you share with us how does your team, calculate the cost of inspection? Is inspection an additional chargable item in the quotation sheet? To quote your posting : "Just a side n
Electronics Forum | Sun Apr 21 22:46:13 EDT 2002 | ianchan
Hi Mates, Previously posted below question, in another thread, but it din get any reply, so posted afresh in a hope some kind folk can shed some light... ***extract commencement*** Out of curiousity and in the name of learning new stuff, can you s
Electronics Forum | Sun May 05 22:18:20 EDT 2002 | ianchan
Hi mate, we had a crap experience (once...no more...) with gold plated over nickle (Au/Ni) PCB that had nickle contaminents in the PCB supplier's gold bath. the Ni caused batch-delivery of the PCB to us for mass production, to exhibit the visible s
Electronics Forum | Sun May 19 21:01:51 EDT 2002 | ianchan
Hi mates, we only do a double side tape sample for 1st pcs output, buyoff the location vs P/N, and orientation. we can recycle use of "A-items" eg. IC... once all this is affirmed, we mass run the rest of the Lot size, via full SMT line configuratio
Electronics Forum | Tue May 21 06:33:37 EDT 2002 | hayashi
*the other components are 0402 and SOIC 16, the > solderability were good. *the protection on the > terminations of microleadframe package is > Cu(copper),somebody call that leadless leadframe > package(LLP). *the time above 210 deg C is about
Electronics Forum | Thu May 23 12:20:08 EDT 2002 | cyber_wolf
Well it depends on what kind of oven you have. If you have a short oven, you are going to have a difficult time. You will probably end up having several different profiles if that is the case. We have 3 BTU TRS 212 furnaces. They are fairly long 8 zo
Electronics Forum | Thu May 23 12:27:53 EDT 2002 | johnw
yngwie, are you getting a wave from the customer to say it's not your fault you fried the parts? Profiling's one of those things that is a pain to dobut it's one of the most important factors in the assembly processes. I've read and seen instances w
Electronics Forum | Tue May 28 21:00:59 EDT 2002 | davef
That is the rub here, isn�t it? For those posting, it�s easier [but much slower] to start a new thread than to search the archives. [And posters could view their issue so unique and novel that it could never have been discussed several years earlie
