Electronics Forum | Thu May 23 11:57:21 EDT 2013 | dyoungquist
We run the same profile for both sides. We also run the bottom temp 10C cooler in the final 2 heat zones.
Electronics Forum | Tue Jul 16 02:48:54 EDT 2013 | trottmann
...Welcome to the dark side of Inspection... Does anybody have experience? Which Manufacturer has the best System? Whats the Problems? What equipment do you use and why? Best regards from the sunny side of Bavaria
Electronics Forum | Mon Feb 24 14:32:57 EST 2014 | navworx
Thanks Bobpan, It was the theta amp; swapped it to the other side and that side then failed. It would only do it once the unit ran for about 30 minutes. But when it happened, it stayed broken. Swapped out with a refurb from ppm.
Electronics Forum | Fri Jul 18 11:31:31 EDT 2014 | jagriffin
Thanks Mac! I have been doing a lot of reading and I think I understand me challenge ahead of me. I do however have a double sided assembly and the BGA's are on the second side. So I know I have to make this a quick build…. June
Electronics Forum | Fri Jul 25 09:54:00 EDT 2014 | emeto
Hello all, what is your opinion on step stencils. Is it better to have the step on the squeegee side or on the bottom side of the stencil? Why you do it this way? What are the advantages and disadvantages?
Electronics Forum | Tue Jul 29 07:24:03 EDT 2014 | jandon
I think you need step on the bottom side of the stencil (undercutting) only to compensate elevations on the top side of the PCB, such as labels.
Electronics Forum | Tue Oct 07 08:44:49 EDT 2014 | emeto
Hi, 1. I will run the board on the mesh if single sided. 2. For double sided board, I will try stiffeners. 3. If stiffeners don't work, then you have to create a handling fixture(holds the board and has enough openings to let the air flow to the PC
Electronics Forum | Mon Feb 09 08:34:50 EST 2015 | saoasasd
In my case most of the PCBs are OSP finishing and worst case of MSD component on bottom side is level 3 (168 hours). You mean that PCB shelf life with bottom side assembled shoud be 84 hours?
Electronics Forum | Tue Mar 03 03:11:57 EST 2015 | vb7007
Hi I also forgot to mention, top side is reflowed first at SMT. Tenting vias is good option. we are looking into it. Can you please also suggest any solution to avoid solder balls at bottom side in other places than vias. Thanks
Electronics Forum | Fri Jul 24 16:37:47 EDT 2015 | cnotebaert
to my knowledge it will always be manual insertion,, if you mean reflow, not insertion, I always apply solder to one side, reflow, then apply tacky flux pre print to the already soldered pins, print op side, assemble part then send through placement
