Electronics Forum | Mon Jul 01 21:03:15 EDT 2002 | ianchan
Dason: Hi mate, Could you help clarify this abit? ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ we found component weight will reduce more than 50% of the moisture weight after place in the cabinet with 55C and less than 5 % for 48 hours ~~~~~~~~~~~~~~~~~~~~~
Electronics Forum | Wed Jun 19 09:17:21 EDT 2002 | doctord
I am looking to create a "User Group" for Amistar equipment. We are a midwest contract manufacturer with several Amistar placment machines. With the recent departure of Qualmax as an I-Pulse distributor, users in the US are left with few options. I w
Electronics Forum | Mon Jan 26 11:24:53 EST 2004 | paul_bmc
It sure would be nice to have some sort of group out there to exchange ideas. I have designed quite a few options that I use for quick change overs on my 5 Amistar Big Body lines. They work quite well and I am willing to share any ideas. My compan
Electronics Forum | Fri Jun 21 12:49:58 EDT 2002 | surinder
Hi Russ, Thanks for your input.My board has SMT Chip components, SOT23,SOIC's & 2QFP (25MIL PITCH). Also,taking consideration that the board is well design for Wave.This board has been designed end of last year. We have latest model of Electrovert ma
Electronics Forum | Fri Jun 21 12:59:20 EDT 2002 | stepheno
When you say well designed for wave, does that include "extra" solder pads for the IC's for solder thieving? And Boards that are well designed for wave don't have QFP's on the bottom. They might be ok but then the board would be "ok for wave", but no
Electronics Forum | Fri Jun 21 16:41:10 EDT 2002 | pjc
If your wave machine has the new style Rotary Chip Wave and the Hot Air De-Bridging Knife options you can expect good yields. However, depending on the PCB design, double-sided solderpaste reflow and selective solder pallets for wave solder is a bett
Electronics Forum | Sat Jun 22 21:06:27 EDT 2002 | jersbo
I agree with PJC.. The mention of 2 QFPs to wave = more than likely rework to remove bridges and a potential to scrap the board, 25mil isnt as bad as 20 or less.. but the potential is still very real.$$$$$$ reflow/reflow is my 2 cents with the possib
Electronics Forum | Thu Jun 20 04:41:47 EDT 2002 | redmary
thanks, but I also encounter the solderability problem. because these boards are HASL or Ni/Au finish, and we print the solder paste and reflow, the result shows the some non-wetting area. and the reliability test also proves to be bad. so the critic
Electronics Forum | Thu Jun 20 14:39:35 EDT 2002 | russ
I use TechSpray Wsol 2204-8SQ. This is a water soluble mask that is very thick and works pretty well for this application. Drying time depends on thickness and you should let it dry at least for a little while prior to running through the wave. Ea
Electronics Forum | Sun Jun 23 23:23:25 EDT 2002 | beldorian
First question - I am making an assumption that after "de-pop'ing" a BGA prior to socketing the thing to test it, the best known practice is to re-ball the thing. Is this an industry standard? Second question - If it is an industry standard, does a
