Electronics Forum | Sat Jun 08 07:06:21 EDT 2002 | cyber_wolf
At each of the machines we have a log book.One of the sections that the operators fill out in the log is called machine downtime, and next to it is a comment section.Any time the machine is not placing parts they make a quick note of why they are dow
Electronics Forum | Mon Jun 10 13:15:32 EDT 2002 | stepheno
My take on it, is that you can't exactly match labour to machine requirements. So the question is, which are you going to focus on? Keeping the machine busy or keeping the people busy. One or the other will have "waiting" periods. To me because the
Electronics Forum | Tue Jun 11 17:12:29 EDT 2002 | mdmilward
Hello, Can I please get some help on finding formulas for calculation of surface mount pad sizes for stencil design and solder paste deposition. I've recently joined a company who has allowed their stencil supplier to develop the stencils based upon
Electronics Forum | Wed Jun 12 08:13:29 EDT 2002 | davef
Don't sound proper. There is no specification. Pad peel strength test methods are: * IPC-TM-650, Method 2.4.21 for multiple solderings * IPC-TM-650, Method 2.4.8 for copper peel with a Instron machine. Typical requirement for Cu is: 6 lbf/in [1
Electronics Forum | Mon Jun 17 13:45:29 EDT 2002 | genny
When the pad comes off, is it leaving behind a "black" area? Your board may be suffering from black pad - a condition that occasionally affects ENIG finish boards. It is a process control issue with your board fabricator. The nickel is oxidising b
Electronics Forum | Fri Jun 14 14:32:05 EDT 2002 | davef
There is no real reason why you shouldn�t use your current paste. Paste for printing usually is a coarser mesh than paste for dispensing. Dispensing paste is more expensive, because of the mesh and the packaging, but that doesn�t matter now. Compa
Electronics Forum | Sat Jun 15 22:39:05 EDT 2002 | edahi
well we can't paste the flip chip on its substrate because we are using flux...because this bare die yet...and the surface of the die flipped might be contaminated...also after chip attach and reflow the die is to be underfilled and if the die is pas
Electronics Forum | Mon Jun 17 21:18:24 EDT 2002 | davef
I don't understand "well we can't paste the flip chip on its substrate because we are using flux". There is flux in paste. What's the difference? If you use solder paste, there will be more room for underfill, as compared to flux only. Some peopl
Electronics Forum | Tue Jun 18 17:01:50 EDT 2002 | kenbliss
Todd, for the sake of the forum could you please spell out a few key line items about why you state the Juki machines is Junki. Clearly you are unhappy with their machine. The best purpose of this forum is to identify problems with machines, proces
Electronics Forum | Thu Jun 20 17:40:03 EDT 2002 | pjc
Depends on which Assembleon machine, aye? The "GEM" line, Topaz & Emerald, stuff is Yamaha- Japan, which I consider more along the lines of Juki and i-Pulse (Tenyru/Yamaha), and maybe Samsung. The "Power" line, ACM & FCM, on the other hand is pure Du
