Electronics Forum | Fri Feb 02 08:22:10 EST 2007 | davef
Try: * IPC-2221, 5.4.3 Datum Features * http://www-ese.fnal.gov/ese-dfe/SMEMA%20fiducial%20mark%20standard.pdf
Electronics Forum | Mon Feb 05 21:56:31 EST 2007 | ViVian
what type of solder paste I should use if Rohs and non rohs component mount on same board
Electronics Forum | Wed Feb 28 15:09:57 EST 2007 | Hussman
Some no-cleans will pool flux on the top of the solder joint which acts like an insulator. I normally do not paste "contact" pads. You can have your board house HASL them if you need the extra bump on the pad.
Electronics Forum | Thu Mar 01 16:03:50 EST 2007 | Brandon
Who removes your HAZMAT bucket waste? We need that too. Yeah it is scraped off the stencil and dryed up. Who removes your dross?
Electronics Forum | Mon Mar 05 08:50:57 EST 2007 | asoelu
i wonder anyone here has the experience with the stencilquik,www.solder.net.they had done a few ads in the past few days I have visited their site and my feeling is their stuff is quite easy to use.Any advice for me?
Electronics Forum | Tue Apr 17 01:53:51 EDT 2007 | Jane
http://ieeexplore.ieee.org/Xplore/login.jsp?url=/iel3/3476/14162/00649440.pdf?arnumber=649440
Electronics Forum | Tue Jul 31 15:03:02 EDT 2007 | realchunks
Hi Karkanov, Depending on how many devices they have, you may want to go spot solder with a laser system or light beam system. This worked well on some aluminum boards we did in the past.
Electronics Forum | Thu Sep 13 13:36:46 EDT 2007 | russ
switch pastes and see what happens, Kester had issues with their fluxes a little while ago and you may have gotten one of the bad batches. R
Electronics Forum | Fri Sep 07 09:55:19 EDT 2007 | russ
what type of solder paste are you using? Why the concern over wetting spread to the edge of pads? Are the solderjoints formed correctly at the component? Russ
Electronics Forum | Thu Nov 08 00:10:55 EST 2007 | omidjuve
don`t we have any article about the manufacturing of high frequency board . and precautions that we should use ?
