Electronics Forum | Thu Jun 20 18:56:31 EDT 2002 | stepheno
If you don't already have one, the best investment you can make in your case is a good thermometer/humidity meter. They are not at all expensive. Then record the temperature and RH about 4 times a shift. After a few weeks (maybe sooner) you can se
Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Mon Nov 11 17:32:50 EST 2002 | dphilbrick
We have a tidy clause in our contract where as we are not responsible for functionality of prototypes. With that in mind we do what ever the customer is willing to pay for! Experiment away my boy! Now for my two centavos on your question. Without s
Electronics Forum | Mon Jan 19 14:54:38 EST 2004 | cyber_wolf
How did you come to the conclusion that you are having a cold joint problem. Just by appearance ? As Dave stated if you have any of the metals that he listed in the joints they will appear to be dull and grainy sometimes. But... Dave, I will have t
Electronics Forum | Mon May 17 16:34:25 EDT 2004 | pjc
I am an equip mfrs rep. I took a customer to my wave solder principal's factory to run their boards on a wave with no-Pb alloy, (Sn96.5 Ag3.0 Cu0.5) in air environment. The results were excellent with pot temp of 263C (505F). Their boards are low to
Electronics Forum | Tue Jun 01 07:26:55 EDT 2004 | johnwnz
Alistair, your paste deposit is controlled by a few things: Stencil thickness Squeegee pressure Squeegee speed Print gap in 99 out of 100 applications for paste printing you would have a print gap of 0 i.e. on contact printing where the PCB is in fu
Electronics Forum | Mon Dec 27 18:44:14 EST 2004 | Mark
I am testing some BGA's (PBGA 30mm x 30mm) to evaluate the maximum ramp rate we can achieve in our reflow oven. Temperature is being measured at the body(top) of the component / not leads. After several trials (with various oven settings), the high
Electronics Forum | Fri Feb 11 08:15:35 EST 2005 | davef
It sounds like you already know the answer. Hand soldering is much more stressful to a board than mass soldering, because: * It is more localized and there is no preheat. * It is more difficult to control. [Different connections require different h
Electronics Forum | Tue Mar 15 22:04:56 EST 2005 | KEN
The hasl joint looks fuller (and is easier to inspect)because it has more solder volume. Think about it. Your pre-plating your board with solder (before you add more solder). I doubt your getting 0.3 mils of hasl.....probably more like 1.3 to 3.0
Electronics Forum | Tue Mar 22 17:08:01 EST 2005 | finepitch
We might need to open up the term "mass production" here, but I will give it a try anyway. I've seen semiconductor packaging companies in the far east where they pick up balls with a vacuum head, consisting of holes matching the pattern of the BGA p
