Electronics Forum: paste inspection (Page 56 of 71)

what is the max print speed? thanks for your help

Electronics Forum | Sat Nov 17 12:58:12 EST 2007 | mika

I agree with previous postings regarding print speed: Solder paste type/versus fine pitch. Question: Is this a double sided pcb with fairly easy component packages on both sides? In such case, consider make the panel like this: Every second pcb in

QFN welding problem by reflux oven 10 zones

Electronics Forum | Tue Feb 11 13:22:22 EST 2020 | rgduval

Sebas, I suspect that your finding of needing the fillet for the card to work is a false finding. One that I dealt with for many years in assembly. As a bottom terminated device, a fillet to the side terminals of the device is not required. Adequ

Re: Process Change

Electronics Forum | Thu Jun 03 14:40:22 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W

Re: Process Change

Electronics Forum | Thu Jun 03 14:41:06 EDT 1999 | JohnW

| | | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. W

Re: Process Change

Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon

| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann

Re: Process Change

Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change

Electronics Forum | Thu Jun 03 13:00:16 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 14:06:16 EDT 1999 | Dave F

| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca

Re: Process Change - Mascots????

Electronics Forum | Thu Jun 03 15:19:14 EDT 1999 | Earl Moon

| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We

AOI in the future

Electronics Forum | Mon May 14 09:43:37 EDT 2001 | orbotech

As the face of business changes through revolutionary factors, such as the increasing rate of outsourcing, manufacturers (especially EMS plants) will strive to fine tune their test strategies to ultimately improve and sustain product quality and to r


paste inspection searches for Companies, Equipment, Machines, Suppliers & Information