Electronics Forum: solder paste printing (Page 555 of 800)

soldering issues with MELFs

Electronics Forum | Thu Jun 26 07:53:39 EDT 2008 | realchunks

Depends on a few variables. Could be the part, your profile, your paste, your stencils..... many things affect it.

Solder balls

Electronics Forum | Fri Jul 18 16:29:30 EDT 2008 | grics

Thats it. 6 mils works great with a 10% reduction. We had also had some issues with our p&p placing the parts to hard and smashing out paste causing a bead to form in the middle of our 0805 packages.

Missprint PCB cleaning

Electronics Forum | Mon Aug 18 17:20:16 EDT 2008 | jlawson

Try Avantec Topklean EL-60, can clean off solder paste or uncured glue, is hydrocarbon based cleaner - but with high flash point. Will evapourate faster than water based solutions, not as fast as IPA , but does much better job.

Pogo Contamination

Electronics Forum | Thu Aug 14 07:44:59 EDT 2008 | davef

Comments are: * Link you posted to your brush actually connects to a general catalog page. * Not sure what solders your friend was using, but pastes leave different residues that affect probing. Some are soft and gooey, others are hard and brittle.

Paste in hole question

Electronics Forum | Mon Aug 18 11:57:37 EDT 2008 | dphilbrick

No I was actually thinking more on the lines of this. http://pcdandf.com/cms/content/view/3845/95/ I think if you try and put solder in the hole you will not have a flat or well filled hole in the end.

Solder not reflowing properly

Electronics Forum | Wed Aug 27 15:48:05 EDT 2008 | grics

Again, our paste manufacturer specifies TAL to be 30-60 seconds. Out of curiousity, how would part placement cause de-wetting? I am fairly new to SMT so elaboration would be helpful... Thanks

SAC105 vs. SAC305

Electronics Forum | Thu Sep 25 08:30:27 EDT 2008 | jwentz

Yes, we are looking at using it for our solder paste. The customer mentioned wants us to test our boards and initially we've heard the SAC105 is better for "higher mechanical stressed" assemblies. Thanks for your reply!!

BGA thermal reflowing issue

Electronics Forum | Fri Sep 26 01:15:05 EDT 2008 | scauter

Can anyone take a look on the cross sectional diagram of this reflowed BGA ball? Any idea on what has happened to this? The PCB surface finsihing is OSP with regular lead-free 305/405 solder paste. Thanks SC

Fifo of Solder Paste

Electronics Forum | Mon Sep 29 11:43:30 EDT 2008 | davef

Similarly, get some racks like this [ http://www.organize-it-online.com/itm_oia-canholder.html ] from the 'dollar store' and mod them to fit your jars and cartridges. We got platic racks.

Fifo of Solder Paste

Electronics Forum | Tue Sep 30 08:16:20 EDT 2008 | realchunks

What makes my statement silly? What is "IT" that I should be already doing. Sorry for not being able to read minds or read between the lines.


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