Electronics Forum | Thu Oct 26 13:56:08 EDT 2000 | ptvianc
Hello: Pre-baking laminates should only be performed:(1) to meet contractual agreements or (2) in response to an actual defect that can be traced to PWB water absortion. Besides the fact that a pre-bake is an enormous process "bottleneck," it also
Electronics Forum | Thu Oct 26 13:26:53 EDT 2000 | ptvianc
Hello: 1. Yes, it is necessary to reball a PBGA after removal from the board. Once the part has been removed, the quantity of solder on the balls is out of control. This condition will not only result in an unacceptable variation in solder quantity
Electronics Forum | Thu Jul 20 12:49:05 EDT 2000 | Bob Willis
So far on all my trials on PIHR I have only used standard products as the paste is defined by the printing requirements for fine pitch etc. As most people will have seen you just get a heap more residues with this process and even more with lead free
Electronics Forum | Fri Jun 23 20:45:12 EDT 2000 | Lee
Hi Dave, You make a very good point. I think that the concern over lead is not so much in user's contact with the lead during the product's active life, but after its disposal. There is some valid concern over lead leaching out of circuit boards
Electronics Forum | Thu Jun 22 13:12:47 EDT 2000 | Lee
Good question Brian. I'll answer this briefly and try to get back to the subject after I get back from a meeting I have to be at shortly (sorry about that!). There are lots of ways to define this new field, but one relatively simple definition is u
Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman
By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data
Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon
My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would
Electronics Forum | Wed May 16 12:08:24 EDT 2001 | raton
Some thoughts- Torque applied to each joint is case specific. I know there are charts and all, but they don't account for YOUR situation such as screwing a fab to a chassis(or your aluminum screw). If the customer sets a spec then use it. (But i
Electronics Forum | Mon Jun 18 01:09:03 EDT 2001 | Dean Stadem
Igmar, If these parts are epoxied in place, and subsequently wave soldered, I would bet you a cup of coffee that they are cracking due to the thermal shock of the wave. Typically there is a valley or dip in the temperature after the pre-heat in the w
Electronics Forum | Sun Jun 24 12:32:22 EDT 2001 | Stefan Witte
I was dreaming about a real easy to use assembly machine. The software was written for operators and did not require more than a few hours training. Machine operations and board programming was written in clear language, icons, pictures and machine e
