Electronics Forum | Thu Sep 16 21:11:10 EDT 2004 | davef
Left to its own devices the plastic used to seal your parts will take-on moisture in the air. When you heat there parts the water in the part expands and can damage the part, if not properly demoisturized. The instustry standards for controlling su
Electronics Forum | Thu Sep 16 21:46:16 EDT 2004 | jeremyt
I work for a major OEM as well, and we have close to 1000 stencils in house. We just recently went to a new way of labeling our stencils. We ordered metal ID tags out of McMaster, and assigned a Number to each stencil. We then attached each tag to t
Electronics Forum | Fri Sep 24 14:42:19 EDT 2004 | jeremyt
Well, to be honest, we have not had any problems with this. We tested several old frames we had inhouse, and put them in our washers for 50 cycles, and they did not get any fluid in the frames. We simply attach the labels with sheet metal screws in
Electronics Forum | Mon Sep 27 10:56:01 EDT 2004 | grayman
First, for new stencil-you must ask you stencil dealer to put the markings before shipping it to you. Second, for old stencil-you buy some old angle bar or any metal plate about 1 inch by 1 inche. you engrave the markings on that plate and screw it
Electronics Forum | Tue Sep 14 13:36:56 EDT 2004 | C Lampron
Hi Simon, I would recommend a thermal profile on a BGA that is mounted directly over another one. The best way to accomplish this is to drill through the first side BGA to just break through the second side. (assuming you have a board that you can d
Electronics Forum | Tue Sep 14 13:54:13 EDT 2004 | paul_boxboro
I'm with Chris' approach as a first effort. If you don't have any luck, consider using a high (reflow)temp solder paste for the first pass reflow, and your standard solder paste for the second pass refow. Years ago I had a similiar challenge with an
Electronics Forum | Wed Sep 15 17:50:24 EDT 2004 | GS
Hi Simon, do not forget BGA have more surface contact ( qty off balls) then a same size of QFP. I mean, theoretically unless the BGA is very heavy, it is more simple to solder mirrored PBGA then try to have QFP on bottom side to be soldered. Are ple
Electronics Forum | Tue Sep 14 12:29:15 EDT 2004 | samaniegocesar
Hello to all of you, may be you can help me, I change the X servocontroller of KME CM82C-MD and when the machine is mounting the component do not mount the component in the correct place, the initial components are correctly mounted but when the mach
Electronics Forum | Tue Sep 14 16:09:39 EDT 2004 | Guest
I want to show our production that changing over the pick&place line can be done much faster than we do now, but only if we organize things in a different way. What I would like to discuss with the operators is how Formula 1 teams are doing their cha
Electronics Forum | Wed Sep 15 05:33:04 EDT 2004 | Rob
Hi, The thing with Formula 1 is that they can afford to throw innumerable bodies at tasks (i.e. 8 people to change 4 tyres, 1 to hold a jack, 1 or 2 to refuel, 1 to hold a stop sign, 1 to hold a fire extinguisher, 1 with a stop watch, and the bloke
