Electronics Forum | Wed Apr 19 04:41:42 EDT 2006 | ge_lim
Hi I am using selective soldering to dip soldering the connector pins to the PCB and would like to know your experience: a) Is there a recommended dip or dwell time for the dip soldering? b) How do we improve the solder coverage in the TH? c) How t
Electronics Forum | Tue Oct 17 11:51:23 EDT 2006 | SteveT
where I can get an install disk for a Comtrol RS232/422 Interface controller? We're upgrading a PC and I need to move the controller but obviously this thing isn't going to be plug n' play, or even plug n' pray. I'm assuming there is one because I c
Electronics Forum | Thu Mar 08 22:35:13 EST 2007 | davef
Suggestions are: * Procure solderable finishes that have sufficient thickness to avoid intermetallic problems and use storage conditions that do not promote oxide growth problems. * Bagging/sealing boards has been shown to extend storage durations i
Electronics Forum | Tue Jun 12 22:03:21 EDT 2007 | davef
The presence of agitation at an air / solution interface and a foaming agent causes foaming. Most water soluable fluxes contain surficants. Surficants are foaming agents. First, it's likely this foaming is caused by poor control of the temperature o
Electronics Forum | Thu Jul 05 22:56:53 EDT 2007 | gyverlo
Hello Sirs: Recently we are having an issue with environmental stress (high humidity or moisture), so we decide to apply conformal coating on our motherboard to protect via holes. According to IPC-A-610D, spec of thickness for type AR is 0.03~0.13 m
Electronics Forum | Tue Aug 28 06:17:11 EDT 2007 | jgrootkoerkamp
I have problems with blowholes during the wave soldering process. I already find out that the stock time between reflow and wave is the most important. The longer the boards are in stock the more blowholes we have. We don't have a climat controlled
Electronics Forum | Tue Sep 25 20:33:02 EDT 2007 | davef
We vote for: IPC-TM-650 2.3.25.1, solvent: 80�C, extract time: 60 minutes, hold time: 30 minutes or until room temperature. Listen, it really doesn't matter which method you decide to use. IPC-TM-650 2.3.25 is a process control method. It's more imp
Electronics Forum | Thu Jan 31 09:23:50 EST 2008 | realchunks
I agree with Sr. and Doug. Capable equipment will run like sh^t if the process is not in control. Number one, don't be scard of BGAs. They are pretty easy if done in control and will cause you less pain than you ever thought. X-Ray is your best i
Electronics Forum | Thu May 15 19:36:56 EDT 2008 | davef
Q1: static or dynamic? A1: search the fine SMTnet Archives. For instance, http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=44837 Q2: localized testing (C3) or bulk testing (Omegameter/Zero Ion)? A2: depends on the contamination that you're
Electronics Forum | Tue Jul 08 12:21:42 EDT 2008 | jwasyliw
Biggest differnce is tooling. Tooling cost with > a fixed pot - no tooling cost with programable > "moving"pot. > > There are various way to control > peel off with a moving pot. Depending on the > machine, you can use either the Z axis or the
