Electronics Forum | Wed Aug 31 10:26:24 EDT 2005 | Carmichael
I respectfully disagree with vapor phase or reflow oven being the technology of choice here. Have you considered straight conduction heating? (ie: hot plate) If you have a lot of these to do you can purchase in-line conduction ovens like the Sikama o
Electronics Forum | Thu May 11 13:28:49 EDT 2006 | patrickbruneel
Being a typically efficient Swiss based company Swatch started the task of RoHS conversion a year ago. After 2 years of intensive research they implemented the process in mass production in June 2005, they started shipping and found massive problem
Electronics Forum | Wed Oct 04 09:55:51 EDT 2006 | borgie
Hi. I have product in lead containing process that consist lead free BGAs and also big ceramic BGAs with high temperature bumbs. Pcb tends to bow in a reflow profile, since I need long preheating times and relatively high peak temperature to melt BG
Electronics Forum | Wed May 16 18:09:15 EDT 2007 | johnwnz
It always surprises me how many variations there are for profiling and controlling your ovens, and the thing is most of them are fairly valid. Here's yet another option: Your board profile needs to be specific, 2 boards can look identical but have ve
Electronics Forum | Thu Jun 07 14:17:55 EDT 2007 | mfgengr
Thank you ChrisW. I agree completely. The decision to idle the temperature or turn the wave off is primarily a function of machine utilization. Period. The utilization % break even point for idle vs. turning the heat off is calculated by comparing th
Electronics Forum | Fri Dec 21 09:20:36 EST 2007 | operator
Hello All, I read AIMs article "Time Above Liquidus". It was very informative and a good read. One thing that the article didn't touch on, that is a mystery to me, is thermal shock to components during the ramp up stage of a profile. If you
Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Wed Jun 18 07:49:06 EDT 2008 | more_sunshine
hi i'm not experienced in creating pcbs but i have good background, and i have a bunch of questions. i have no access to world wide known pcb chemicals but i managed to get a cramolin positiv spray and i don't know if it is still usable or not? (di
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Thu Sep 18 17:11:57 EDT 2008 | realchunks
When looking at surface mount equipment you also have to remember your line pull process. Wil you issue reel of parts or just strips? Most of the bigger machine cannot take strips of parts. What about your set-up? Will you have a dedicated top an
.gif)
