Electronics Forum: paste inspection (Page 57 of 71)

Re: Criterion of PCBA bending degree

Electronics Forum | Thu Jun 10 12:05:22 EDT 1999 | Deon Nungaray

| | Hello all! | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it's th

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 01:40:40 EDT 1999 | Gyver

| | | Hello all! | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt it'

Re: Criterion of PCBA bending degree

Electronics Forum | Fri Jun 11 03:39:26 EDT 1999 | Gyver

| | | | Hello all! | | | | Recently we got a problem about the Funtional test. Some boards passed tests by using the auto-fixture(vacuum), but failed by using manual test fixture(need to plug CPU, DIMM etc.). The error symptom is no picture. We doubt

Re: BGA's - Re-ball

Electronics Forum | Wed Jun 30 18:02:53 EDT 1999 | Mark

| What is the best way to re-ball a BGA? Who has the best system for doing it? | To RE-Ball an IC you must re-BALL the IC! The idea of using a stencil to deposit all of the appropriate solder mass can not work. Here is the process (minus the app

Re: SPC on stencil printer

Electronics Forum | Tue Jan 12 19:07:07 EST 1999 | Earl Moon

| | For process management with SPC of the stencil printing process with a fully automatic stencil printer, what process outpur parameter would you recommend for SPC? | | | | It appears to me that there are two options: | | A: to have a pn chart bas

Re: Ball Grid Array (BGA)

Electronics Forum | Thu Sep 10 21:48:37 EDT 1998 | Dave F

| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re

AOI, Pre or Post Reflow?

Electronics Forum | Mon Mar 10 10:14:10 EST 2003 | pjc

Most pre-reflow AOI systems today can easily keep up with production line beat rates. Pre or Post reflow AOI is the difference between process control vs. defect screening, in my opinion. Pre reflow repairs cost much less than post. Pre AOI is for

Nozzle life?

Electronics Forum | Thu Feb 24 06:11:18 EST 2005 | siverts

Nozzle used? Nozzle tip damaged/worn-out (that's where the nozzle life comes in)? Component package? Heavy component? Feeder? Do You see that component type, used by that nozzle inside the machine, or components at the wrong spot on the pcb? If so, t

Who has best desktop AOI ?

Electronics Forum | Wed Nov 03 14:08:55 EDT 2010 | clampron

Good Afternoon, I would throw my vote in to Mirtec as well. I also had an opportunity quite a few years ago to compare three systems side by side. At the end of the evaluation, the Mirtec stood out over the rest. Over the past several years, I was in

Machine AOI

Electronics Forum | Tue May 22 07:55:05 EDT 2012 | rway

Although not listed in your post, I recommend YesTech. I have been using them since 2007. We have two M1 systems, and they have been good machines. We evaluated three: YesTech, Mirtec, and Christopher. Of the three, the YesTech system caught more


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