Electronics Forum | Sat Mar 05 22:57:32 EST 2005 | gpaelmo
This has been our practice and its worked well: SMT process-QC/Touch-Up-Assembly. We have dedicated QC/T-Up after reflow trained under IPC requirements. They do the SMT inspection and ONLY touch-up if necessary. This way we never have to inspect SMT
Electronics Forum | Sun May 28 23:01:31 EDT 2006 | jacksaria
Hello to all, We are encountered many problems/defects in SMT lines.I would like to know your suggestion or recommendation for SMT optimization and improvement. What are the step by step solutions in order to optimized and to improve the printer, pi
Electronics Forum | Thu Aug 08 13:09:38 EDT 2013 | cyber_wolf
Hege, there is no actual calibration of the thermocouple itself. You can however verify that they read correctly. Heller sells an option on their reflow ovens specifically for this purpose. I hoping that someone chimes in here that is NADCAP certifi
Electronics Forum | Thu Jul 22 17:39:58 EDT 2021 | proceng1
We do use a company for custom fixtures, but we also make some in house. The biggest hurdle for a board that requires a fixture to go through printing and SMT is that the board has to be the tallest thing. So any hold downs or locating hardware has
Electronics Forum | Tue Nov 28 21:16:17 EST 2006 | davef
J Rose at EMPF says: The introduction of no-clean solder fluxes in electronics manufacturing has given rise to greater levels of solder balling simply because the opportunity to remove them in the wash process does not exist. They are typically cause
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
Electronics Forum | Tue Jan 14 19:41:32 EST 2020 | avillaro2020
Hi Evtimov, Thanks for your response. Yes, the vapour phase is suppose to handle big and heavy boards, at least thats the intention. Well our thin board is like around 3mm which is not really thin. In our application the thicker the boards means more
Electronics Forum | Thu Sep 10 17:38:30 EDT 1998 | Dave F
| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the
Electronics Forum | Mon Oct 13 13:34:13 EDT 2003 | caldon
HI Andrea- to answer Q: 1) Stencils can be order through various vendors that manufacture stencils. You would need to have CAD data for the Stencil company to make them. You design engineer should have the CAD info. Also, the stencil design company c
Electronics Forum | Fri Sep 07 14:09:57 EDT 2001 | aqueous
Hi Carol, Pressure requirements have changed over the past few years. In the recent past, aqueous cleaning systems relied on high flow, low pressure �flooding� techniques. 20 � 30 PSI pumped through large orifice nozzles. With ever increasing boa
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