Electronics Forum | Thu Feb 20 07:48:16 EST 2020 | benreben
Hello, The oven profil is not the solution! The only solution for the solder mount on the side is to put gel flux on the side of qfn and make a second travel in reflow . The flux remove oxyde from the copper that is not tinned and the solder is able
Electronics Forum | Mon Jun 08 09:22:10 EDT 2020 | vinitverma
I guess the link you sent shows Top Side of the component. Send a picture of the bottom side - which the camera will see and I may be able to help.
Electronics Forum | Tue Sep 29 18:54:17 EDT 2020 | smitty
Has anyone experienced issues with the Red-E-Set support system damaging components on double sided boards? How's the setup, its advertised as quick? Any issue with misprints using this support system?
Electronics Forum | Fri Apr 30 12:27:53 EDT 2021 | amaliahx
Dear Sir, We suggest doing only single side V-scroe , not double side . We are able to do it if you like Email :sales@pcbstartech.com Skye: skype: amalia.zeng Wwww.pcbstartech.com
Electronics Forum | Tue Jul 13 11:21:28 EDT 2021 | stephendo
You may have to use an adaptor board. A small board with one footprint on one side and the other on the other side. Do not assume that the pin outs of the two parts are the same. I have seen smaller parts with a different pin out than the bigger part
Electronics Forum | Tue Oct 05 14:06:26 EDT 2021 | oclsc
Hi SMTnet. It is possible to reflow BGA's 0.65 pitch with a convection oven that only have heating zones on one side (topside) or is it a must to have heating zones on both sides in the oven (top and botton). Regards Ole C. Denmark
Electronics Forum | Thu Oct 21 15:53:00 EDT 2021 | jdengler
Why is your customer controlling your process? You should be the expert on your processes. As long as the components that are on your second side would stay if they were processed as the first side this would be an acceptable solution to your issue
Electronics Forum | Fri Jan 14 23:31:35 EST 2022 | tey422
First of all, like I said before, I only worked on similar type of part. For this part, I would add at least 1 of 0603 size solder bead at each end (091845.jpg), 2 of 0402 size solder beads side by side would be even better.
Electronics Forum | Tue Apr 19 17:34:34 EDT 2022 | dwl
Be careful of MSL level 4 or higher devices on the first side. if they sit out 3 days, they will need to be baked before second side reflow or you risk component damage.
Electronics Forum | Thu Oct 13 21:43:47 EDT 2022 | sarason
If you are running resonable volumes of the board, redesign it with equal copper on both sides. One way of achieving this is to just run copper flood planes on both sides of the board, this is a fairly common technique in RF and noise sensitive analo
