Electronics Forum: store (Page 57 of 82)

Electrovert - MiniPak 300, FDC 450 controls, setting Threshold

Electronics Forum | Thu May 31 18:21:09 EDT 2007 | jamesm

Revelation Industries has an Electrovert MPK1-24774. The manual lacks sufficient information to troubleshoot and fix this problem: Reference: Minipack 300 Wavesoldering System 1986 edition, pg, 18, fluxer, Threshold adjustment. After completin

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 09:05:09 EDT 2007 | davef

There are no requirements acceptance criteria for baking of board assemblies. What are your customer requirements? The common reasons people choose to bake PCB are to prevent: * Delamination of multilayer boards * Measles, particularly on double si

Blowholes during wave soldering

Electronics Forum | Mon Sep 03 09:48:12 EDT 2007 | davef

Joris We don�t know the maximum period to store the boards without having problems with blowholes. Too many variables to determine. We prefer to just fix the problem, but understand that you have stock that you need to build-down. Determining mois

CP6-4000 nozzle centering errors?

Electronics Forum | Thu May 29 14:57:26 EDT 2008 | rodrigo

Hi all, Is it normal for some of the small nozzles to be rejected by the wide view camera? Every time I do a nozzle centering the narrow view camera shows green circles for nozzles 1,2,3,4. The larger ones (5 and 6) show the asterisk. The wide view c

Curing Conformal Coating

Electronics Forum | Thu Jun 05 05:27:13 EDT 2008 | andy1975

Hi, I've been looking into UV cureable conformal coating and the UV ovens but a chemist I know is very negative about this. He suggest by heating standard conformal coating to 90deg for a couple of minutes will make the product good enough to handle

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 09:59:47 EDT 2008 | rarnold

Paste stored tip down, so separation in the tube is not suspect. Remember that the defect was produced on a screen printer running with a Rheopump. A few more details are that the strip of the board containing the uncoalesced solder is consistent w

PBF BGA or PB BGA

Electronics Forum | Mon Dec 01 12:39:06 EST 2008 | tsvetan

this is really nice one ;) paper and cotton have lowest potential to generate static electricity see below, and usually is good practice to wear cotton glowe at least to one of your hands to not leave greasy finger spots on the gold finish of the PC

Water cleaning and Moisture Entrapment

Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs

I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle

Damaged Components by Reflow Process (Process Window)

Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp

Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist

underfilling of bga

Electronics Forum | Fri May 22 16:00:54 EDT 2009 | pjc

Henkel- Hysol seems to be the most popular material that I see: http://www.henkel.com/cps/rde/xchg/SID-0AC83309-B331D246/henkel_com/hs.xsl/12169_20090505-henkel-launches-next-gen-underfill-20681_COE_HTML.htm As far as application method, its all ab


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