Electronics Forum | Thu May 29 14:21:22 EDT 2003 | swagner
Thanks for the clarification, I have worked with both application, especially pre reflow. The data you should consider collecting pre reflow is missing, skew degrees, x,y shift, bill boarding, polarity and match the failure data (ref. desg.) to feed
Electronics Forum | Tue Jun 10 20:31:55 EDT 2003 | iman
In a perfect world, the machines would be maint."guys" for the automation machines. Think "closed loop" system. Anyway, getting back to our reality job, we are still game for automation to improve thru'put, quality, reduce problems. The focus here
Electronics Forum | Tue Jun 10 10:58:54 EDT 2003 | Frank
Hi, I currently work on SMT department to uptimize all process. I've just selected the solder paste after testing 15 different products. To be able to do that, I had to create a procedure to evaluate each paste and to be sure that my profil was per
Electronics Forum | Thu Jan 29 06:58:40 EST 2004 | davef
Ramp / Soak: Tombstoning is occuring during reflow. You need to get more heat into the ground plane. Obviously a ramp aint gettin' it done. Further, without intending to disrespect your internal discussion, if a linear profile improved the situati
Electronics Forum | Tue Apr 27 17:37:30 EDT 2004 | Ren�
We have switched over form Indium's nc-smq92 to > nc-smq92j and are experiencing a ton of solder > balls. Even if the print is dead on we still seem > to be getting them. We never seemed to have this > problem with old paste unless the print was
Electronics Forum | Thu Mar 31 06:09:19 EST 2005 | amstech
Yes, components do contribute to the non wets in fine pitch reflow. Oxidation is the main culprit. May ask where it is coming from. Can not say in particular. May be burn in test process or end of line baking, hot / cold testing and need to run DOE'
Electronics Forum | Sun Mar 13 23:30:59 EST 2005 | VS
After reflow AOI makes sense because it has the highest coverage of the defects. Problems like tombstone, lifted pins, open solder joints, some shorts and insufficient solder you will not find before oven. I would also not agree with the statement th
Electronics Forum | Sun Aug 14 22:58:17 EDT 2005 | crishan
Hi All, I would like help in establishing what is a feasible PPM reject rate from a typical SMD line. As a reference an SMD line consists of, solder paste printer, chip component placement, pick and place IC components and reflow. What is a bench
Electronics Forum | Thu Sep 08 01:58:08 EDT 2005 | darby
0. Any less and you are scooping the paste from the aperture with the squeegee blades. I'm not saying that either of these situations is a good or a bad thing, it's just that if you buy a 6 mil stencil, you are trying to achieve 6 mil paste height.
Electronics Forum | Thu Nov 03 10:19:52 EST 2005 | Rob.
Tell me about it, I've set up & run places with placement capacities of 180K & 300K Per hour, and on the other side places with around 2-5KPH (if you ran quick enough between the machines & were nifty with a rubber blade). And I've worked for some o
