Electronics Forum | Tue Mar 22 06:11:17 EST 2005 | Grant
Hi, Yes it costs more, but would get full speed production. We design our own products, so can fit them to manufacturing which is nice. Currently that means no underside components at all! Regards, Grant
Electronics Forum | Mon Apr 25 05:37:35 EDT 2005 | Bryan
Some weeks has passed,Can SMT eng. show us your results of this issue?so that we can learn something from it
Electronics Forum | Tue Apr 12 06:12:13 EDT 2005 | rlackey
Print it, place it,(Don't reflow it) check it, remove valuable parts & wash it. You could use double sided sticky tape but it leaves crap all over the board when you remove it. Rob.
Electronics Forum | Wed Aug 31 12:33:25 EDT 2005 | Jaya
I have expirence running,double sided Imm gold boards recently which ed up a lot of solderability issue. The Imm gold need to be slightly more control during reflow oven area on it's profile.
Electronics Forum | Thu Nov 03 12:02:42 EST 2005 | jrr3434
JP We are a CM planing doing a high mix of boards ranging from 2"x4" to 8"x10" in a single run of 10 to 50. We don't plan on doing any double side boards. Jay
Electronics Forum | Wed Jul 19 14:53:39 EDT 2006 | amol_kane
i think the most important thing to consider is the # of reflows. is this a double sided assembly? if so OSP degrades during the first LF reflow. also there are many studies out there that show the wetting on OSP is inferior to some of the other comm
Electronics Forum | Mon Sep 25 08:15:53 EDT 2006 | egrice1@wi.rr.com
Most companies are double sided paste and reflow, then selective soldering the thru-hole. This will give you the best results and with much more consistency than with Wave Soldering.
Electronics Forum | Wed Sep 20 16:34:13 EDT 2006 | jimmyjames
no, we can't go to screening as the majority of the products being glued are already stuffed with through-hole that has been bent and clipped. (boards weren't laid out in a fashion that allows for double sided SMT then through hole insertion)
Electronics Forum | Thu Dec 07 12:18:28 EST 2006 | realchunks
It may be for a double sided reflow process. Yes, some people do put the BGA on first. I know this first hand.
Electronics Forum | Fri Jan 19 14:29:19 EST 2007 | I.P. Freely
What is the part designator? A lot has to do with that. Also, is this a double sided reflow board. Perhaps you need to change your process to accept two heat cycles simultaneously. Solder thieves should work. Check the archives.
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