Electronics Forum | Wed Jun 20 09:19:14 EDT 2001 | Gil Zweig
Dave: Your question is very astute. First let me make the observation that x-ray imaging is a technology that not many people in electronic fabrication are familiar with (but some think they are); consequently they are gullable acceptors of sales dis
Electronics Forum | Tue Jul 03 08:14:49 EDT 2001 | Stefan Witte
If you hold your board sideways in a 90 degree angle you apply a force of 1 g to your components. 1 g translates into 32 ft / sec. square. This is not too much acceleration for fearless roller coaster drivers but Melf�s and Tantalums can fall off at
Electronics Forum | Mon Jul 30 11:10:41 EDT 2001 | hinerman
There are several things to look for in a compliant tooling system 1. How much force per pin is required to lock the pins in place? This is especially important since you will be multiplying by the total number of pins on all modules. 2. Is ther
Electronics Forum | Fri Aug 03 12:13:59 EDT 2001 | hinerman
T.A. board lok is fixed tooling. I have not used it, and therefore cannot comment on it. Their website describes it in detail for those interested. -The Grid-Lok system is completely pnuematic -Each pin locks individually via mechanical lock -Each
Electronics Forum | Thu Dec 16 06:59:43 EST 1999 | Christopher Lampron
Calvin, We have found several reasons for solder beading occurance. We have found that solder balling is usually directly attributed to the reflow profile while solder beading is usually (but not always) a result of either excessive solder paste volu
Electronics Forum | Fri Mar 19 19:05:27 EST 1999 | Earl Moon
Folks, I think we are getting closer to being very happy with DEK stencil printers of the 265 GSX variety. However, problems continue arising concering fine pitch autoflex tooling pin breakage. We are told by the British engineering establishment,
Electronics Forum | Sat Mar 13 14:39:01 EST 1999 | Earl Moon
Finished profiling this morning for a particularly obstinate board. Couldn't raise the nozzle as many of you suggest, and SRT promotes, because of dense population around every associated rework part. However, we did get good removes (TC'd and verifi
Electronics Forum | Mon Nov 09 11:56:59 EST 1998 | Stefan W.
At least I can imagine what happens and it may solve your problem. If the vacuum is already turned on above the component there will be an airstream above and around the component. This might even suck the air out of the cavity, which supports the co
Electronics Forum | Mon Sep 14 07:19:34 EDT 1998 | Wayne Bracy
DB Sure, it is always possible to "duck in outside air" to use with production equipment, but be careful, you have to determine the air quality required for your process. Cosnsider moisture, contaminates and the actual forcing of air into a confine
Electronics Forum | Sat Sep 12 20:34:05 EDT 1998 | Rick Bell
| | | I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents becaus
