Electronics Forum | Wed May 07 21:20:53 EDT 2008 | davef
Causes of Delamination ["Quality Assessment of Printed Circuit Boards" Lund, Preben; Bishop Graphics 1985 0137450354] The reason for delamination is epoxy starvation in the glass cloth layers or an incomplete curing of the base material. It has been
Electronics Forum | Wed Jun 18 07:49:06 EDT 2008 | more_sunshine
hi i'm not experienced in creating pcbs but i have good background, and i have a bunch of questions. i have no access to world wide known pcb chemicals but i managed to get a cramolin positiv spray and i don't know if it is still usable or not? (di
Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef
We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are
Electronics Forum | Thu Sep 18 17:11:57 EDT 2008 | realchunks
When looking at surface mount equipment you also have to remember your line pull process. Wil you issue reel of parts or just strips? Most of the bigger machine cannot take strips of parts. What about your set-up? Will you have a dedicated top an
Electronics Forum | Tue Jul 28 20:11:14 EDT 2009 | hohk
Thanks Davef! 3M's product description of "3M™ XYZ-Axis Electrically Conductive Adhesive Transfer Tape 9719 is suitable for attaching low surface energy (LSE) EMI shields to electronic and electrical devices where high temperature (up to 400C) is re
Electronics Forum | Mon Apr 19 15:45:21 EDT 2010 | dwonch
Thanks to all for your input. We did have a third party do an analysis on boards from the first shop. They were shipped directly from the board shop to eliminate the possibility that we could contaminate them. The third party (Forsite) did find Sili
Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm
It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen
Electronics Forum | Fri Dec 03 16:00:48 EST 2010 | glenseely
When faced with high mass, high cost, sensitive PCBs and now with the added challenges of Pb-Free Vapor Phase is the only safe reflow method for component and joint integrity. A-Tek is the National Distributor for Asscon Vapor phase reflow. Asscon
Electronics Forum | Fri Jan 28 19:24:15 EST 2011 | jlawson
Should contact Rehm Thermal they have a whitepaper on pros and cons of Vapor Phase vs Convection.... Vapor phase traditionally targeted heavy PCB, large mass products better then lighter ones, due to ramp rate control being harder to attain vs say a
Electronics Forum | Sat Apr 21 04:39:45 EDT 2012 | brotakul
I am using different equipements for SPI such as Koh Young and Cyber Optics machines. I am looking for implementing a general procedure (SWP) for setting LSL's and USL's on the products on which the customer does not specify any limits on the solder
