Electronics Forum | Fri Dec 24 05:12:08 EST 2004 | Patrick Tavernier
Hi ! Thank's for your replies. I'm seeing you're very concerned about this subject. I think RoHS and WEEE arrive too soon. Not technological solution about whiskers and tin pest. RoHS implicates a lot of money for to implemente news process. We must
Electronics Forum | Tue Feb 01 15:54:53 EST 2005 | jbrower
Hi George, The simple answer is that if you're company only does business in the US, or South america or Antartica or any where else that you aren't frozen out due to RoHS and the WEEE directives, then going lead free may not make sense. Unless your
Electronics Forum | Fri Feb 04 08:15:02 EST 2005 | aj
We are starting to look at doing some trials at the mo. I have attended a couple of seminars with one on Wave Soldering coming up soon.Loads of info. now have to make sense of it all. Just a couple of questions/advise on how other people have approa
Electronics Forum | Fri Aug 12 09:50:19 EDT 2005 | fctassembly
It is true that the SAC alloys are very aggressive to unprotected solder pots but the SN100C lead free alloy can be used in these pots IF they are not already being wetted by your SN63 alloy. FCT Assembly offers a program that includes free tin wash
Electronics Forum | Wed Aug 31 06:33:04 EDT 2005 | Slaine
if a solder has over 85% lead its classed as RoHS complient because its difficult to achive the same melting point with anything else (298degrees). a few other alloys with a similar range are ; % % 266E266 82.6 Cd 17.4 Zn 271MP 100 Bi 280E2
Electronics Forum | Wed Sep 07 04:28:26 EDT 2005 | Slaine
were looking at paste, wire, preforms and solder bars (for solder pots), concentraiting on HMP, sn62,96S, and 2 different sac alloys, we also have 7 different fluxes and 16 temination inks (which were also having to change for RoHS because the ink co
Electronics Forum | Thu Sep 08 06:19:55 EDT 2005 | lupo
Hello, Could anyone provide some support concern issue with vertical fill of through hole solder. Our lead free wave soldering process is not capable to fill 100% (requirement of our customer)through hole. We made everything (DoE) - different amoun
Electronics Forum | Wed Nov 02 01:30:12 EST 2005 | fctassembly
Hello Arnold, Yes, by definition of joint formation, copper will dissolve in lead free solder in order to form the connecting intermetallic layer. There is a distinct difference in the copper dissolution rates of the major alloys being considered wi
Electronics Forum | Thu Nov 03 08:18:17 EST 2005 | fctassembly
Hello Arnold, Just to clarify the Sn100C discussion: Please note that SN100C is the Nihon Superior alloy composed of tin/.7copper/nickel. The key point in regard to SN100C is that Cu does not go directly into solution but first reacts to form an inte
Electronics Forum | Tue Jan 10 14:44:42 EST 2006 | greg york
Not sure about Sn/Cu/Ni large market share here in Europe as we have a large part of the UK market with SACP0307 alloy 0.3%Ag introduced over Two years ago Also worked against Sn/Cu/Ni alloy with large TV Co and they went with 0.3%Ag due to reliabili
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