Electronics Forum: viewing (Page 5731 of 7896)

Cracked Joints & Ultrasonic Welding

Electronics Forum | Tue Nov 01 10:48:24 EST 2005 | Rob

Can't say too much about the solder joints issue, but about a decade ago we did have a lot of problems with resonators being damaged by harmonics from Ultrasonic board washing & Ultrasonic welding. However this mostly manifested itself as cracking i

Fudical, where, size, etc

Electronics Forum | Wed Nov 02 20:42:55 EST 2005 | erokc

Russ, thanks for the explination. Makes sense now. DaveF, where do I get the documents you listed? Why is me username (erokc) for login showing as Author instead of my display name? I've checked my preferences, it's still shows Dave??? Is there

does copper wire become thinner when it dip to leadfree solder?

Electronics Forum | Wed Nov 02 21:58:17 EST 2005 | KEN

Copper wire will become thinner when dipped in tin/lead or lead free solder. The copper is disolved off of the bulk wire. This is one reason rework on solder pots must be restricted. Eventually, after repeated cycles you will have smaller and sma

Gel Flex Support

Electronics Forum | Wed Nov 02 11:39:27 EST 2005 | ianlg

Hi We've been given a similar system to trial on our own printers called the 'VacuNest'. It's similar to GelFlex etc and seems to give a very firm support and will hold its shape for months until the vacuum is released. Has anyone else been using

Gel Flex Support

Electronics Forum | Mon Nov 07 12:36:19 EST 2005 | novatec

Hi We've been given a similar system to trial > on our own printers called the 'VacuNest'. It's > similar to GelFlex etc and seems to give a very > firm support and will hold its shape for months > until the vacuum is released. > > Has anyone

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood

We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu

Wire bonding pull strength & substrate contamination

Electronics Forum | Thu Nov 03 12:48:14 EST 2005 | Rosewood

We have some no sticks, but that is actually a good thing because we have NSD. During process control audits we found that pull strengths to the board dropped off. We build a military application that requires higher bond strenghts. Low pull streg

solder paste shelf life

Electronics Forum | Thu Nov 03 08:34:25 EST 2005 | Slaine

Hi We currently use a small amount of Alloy : 43Sn 43Pb 14Bi Flux: RMA-51AC, Metal : 88.5%. We use it for reworking a product and only consume about 100g per year, we are in the middle or ordering in some more paste but the MOQ is 500g. Is it possibl

Lead Based Paste / Lead-Free BGA

Electronics Forum | Thu Nov 03 10:33:04 EST 2005 | Samir Nagheenanajar

I've read all the SMTNet threads available on this topic, been to a couple seminars, and read some articles, and the general consensus seems to be "it can be done, but shouldn't." However, at my company, we have a Pb-Free (SAC alloy) 256 IO BGA comi

Any Recommendations? Lead-Free Reflow Oven and Wave Machine

Electronics Forum | Thu Nov 03 21:37:06 EST 2005 | fastek

Any decent 7-zone reflow oven rated at 300 degrees C will handle lead free. Prices for used ovens in this range begin around $15K. For waves, the prices are all over the map. Send me a private e-mail and I'll introduce you to a friend of mine who sel


viewing searches for Companies, Equipment, Machines, Suppliers & Information

Void Free Reflow Soldering

Easily dispense fine pitch components with ±25µm positioning accuracy.
thru hole soldering and selective soldering needs

Have you found a solution to REDUCE DISPENSE REWORK? Your answer is here.
Hot selling SMT spare parts and professional SMT machine solutions

Software for SMT placement & AOI - Free Download.
Shenzhen Honreal for all your SMT Equipment needs

World's Best Reflow Oven Customizable for Unique Applications