Electronics Forum | Sun Apr 30 22:29:23 EDT 2000 | Jack
We use Fujicam for FUJI CP643 programming and optimizing in our plant. There are about 800 parts (80% chips and 20% lead components) being placeed by 2 CP643. When using Fujicam automaticly allocate feeders and optimize insert order, I got 29000 cph
Electronics Forum | Thu Apr 27 08:20:14 EDT 2000 | obrienk
When I look at most placement machine supplier's web sites, I only see the placement machines. I don't see any info on printers, ovens, board handling, etc.? If Philips, for example, were to put together a solution for me, how do they handle those
Electronics Forum | Wed Apr 26 10:59:54 EDT 2000 | Jose Baez
Sal: You are Correct running firts the reflow side then glue side. In my Experience I've seen a reverse procesess( first glue"cure" and then reflow side) but the quality results were not good, because We realized the Glue tent to cristalise and when
Electronics Forum | Wed Apr 26 11:50:18 EDT 2000 | Wolfgang Busko
Hi Sal, the way you do it has IMO some advantages: - no sophisticated support for the topside print - no extra thermal stress for the the bottomside bonding material - less possibilities to lose bottomside components by handling One disadvantage mig
Electronics Forum | Thu Apr 13 10:45:49 EDT 2000 | Jacqueline Coia
Hi there, Has anyone got any 'positive' thoughts and advice on wavesoldering mini-melf components on solder side of PCB. So far results have been crap, in some cases both pads completely skipped. Is this type of problem generic with mini-melfs or mor
Electronics Forum | Fri Apr 14 04:10:26 EDT 2000 | Richard
We have been wave soldering mini-melfs for many years. Main problem for us has been excess and bridging joints but few skips. To overcome our problem we provide a minimum of 0.5mm clearance around each component, not great use of real-estate but prov
Electronics Forum | Wed Apr 12 15:28:46 EDT 2000 | Kevin Facinelli
I am interested in any techniques that may be utilized for bottom side soldering of Chips and Resistors on circuit cards populated on both sides containing through hole parts. Our current process is : Stencil solder paste Place a glue dot Place P
Electronics Forum | Mon Apr 10 22:32:14 EDT 2000 | Dave F
Mark: If you're looking for a baseline document for judging the acceptability of: * Mechanical assembly * Component installation * Soldering * Cleanliness * Marking * Coating * Laminate condition * Discrete wiring * Surface mounting of components .
Electronics Forum | Fri Apr 07 16:04:34 EDT 2000 | John
Anyone out there using solder paste (dispense) on through hole technology parts? I would like to know how it's working out for you. Which method or technique are you using? Have you ever tried to dispense on the component side and place through the d
Electronics Forum | Mon Mar 27 19:29:14 EST 2000 | Garo Donabedian
I ran six boards with uBGA, and all six have voids 25-30%. I would like to know what would cause this since this is my first time running into this problem. also I would like to know how does a void effect the components function the customer does no
