Electronics Forum | Fri Dec 27 10:04:56 EST 2002 | haran
Big pad located at the middle of the package. On the PCB,we need to have solder paste printed on the thermal pad which is at the middle and the other pads of the perimeter BGA.
Electronics Forum | Wed Jan 22 14:14:56 EST 2003 | Stephen
Most of the design considerations will be for the wave soldering of the SMT parts. Have you considered selective soldering pallets or masking as an alternative? One problem I have seen with the epoxy process is parts that are high off the board and t
Electronics Forum | Fri Feb 28 12:08:07 EST 2003 | davef
Paul We don't like to mix metals on press fits. Yano, we do gold on gold or solder on solder, but we don't mix metals [except with imm silver / tin] to avoid electrochemical corrosion. Is that bad information or does AMP think that's not a problem
Electronics Forum | Thu Mar 06 09:50:38 EST 2003 | ksfacinelli
I am interested in your experience with dross reclamation equipment. What percent solder can be recovered? Who makes a good system? Thanks, Kevin
Electronics Forum | Thu Mar 13 19:11:03 EST 2003 | Wes
Does a third solder reflow compromise component and solder reliability? We find that the only way to rework a particular BGA without warpage is to reflow the entire board.
Electronics Forum | Tue Mar 18 07:53:39 EST 2003 | Paul Staniford
I am looking at dispensing solder paste using a Fuji GLV glue dispenser. This is to enable us to produce prototype pcb's without the need to purchase a stencil. Has anybody tried this before? If so what problems should I expect to encounter.
Electronics Forum | Tue Mar 18 09:09:37 EST 2003 | pjc
The FGLV has a air pressure displacement valve, which is designed for adhesives. A positive displacement valve is better suited for solder pastes. Check with Fuji to see if they offer optional valves.
Electronics Forum | Thu Mar 27 11:49:18 EST 2003 | kenlchin
In printing,the thickness of solder paste perpendicular to the Squegge direction is always lower 1 mil than that parallel to the Squegge direction,so Insufficient Solder may occur.I think you may slow printing speed or widen appertures to resolve it.
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Mon Apr 14 10:50:43 EDT 2003 | emeto
Pete I'm not very informed about it but from the things I red today - 2D inspection : solder component solder joints x-ray and what ever type exsist.
