Electronics Forum | Tue May 16 15:30:07 EDT 2006 | George
Hi John, Are you talking about cleaning the pallets after running to store them? or during production? well in any case...I recently started to use this cleaning solution "Cybersolv" from Kyzen. It is water soluble and also can be used instead of IP
Electronics Forum | Thu May 18 10:48:09 EDT 2006 | vikkaraja
Hi There, I used to have a similar problem with all of our new heller ovens. I converted them with fan blower controller kit. It is really easy to do or you can have done. Its about $900/oven. For now if you do not feel like investing any money , go
Electronics Forum | Wed May 17 12:08:04 EDT 2006 | Mark
Hello, I have recived from customer PCB where he found that big SMD electrolytic capacitor just fell off. I checked this boards (FR4 , Au/Ni coating). I noticed that all solder remained on the termination of capacitors and looks ok but on the boar
Electronics Forum | Wed May 17 13:07:09 EDT 2006 | Chunks
I would suspect touch-up/repair, unless all your caps are falling off. I know our operators use two irons to solder both sides at the same time. If it's not flay and square, yo may get the defect you are talking about. Another area is co-planari
Electronics Forum | Thu May 18 11:00:51 EDT 2006 | Chunks
Thanks Doctor - as always, you're right. I must've been typing with my mittens on. It's starting to get cold on this part of the planet these days. I wasn't blaming anyone, just trying to take a few questions marks away so "we're" left with the an
Electronics Forum | Thu May 18 11:27:36 EDT 2006 | patrickbruneel
I'm not on the production floor on a daily basis like the other guys here but here's my 2 cents: With a Ni/Au plating the inter-metallic that needs to be formed is Ni/Sn. Ni/Sn inter-metallic requires higher peak assembly temperature and a longer dwe
Electronics Forum | Thu May 18 09:18:33 EDT 2006 | Chunks
Hi dwelch123, 8 mils seems a bit thick to me. I would normally go 6 or 5 mil for fine pitch such as this. One other area to check is the the snap off. Are you using the slow snap off or just lowering the board right after print? If so you should
Electronics Forum | Thu May 18 10:20:55 EDT 2006 | slthomas
Russ asks good questions and I think Chunks pretty much nailed it. Aspect ratio (aperture width/stencil thickness) s/b 1.2 minimum (I like 1.5 if I can get it). If your aperture width = lead width (.008"), yours is 1. Tough to get consistent paste r
Electronics Forum | Wed May 17 23:59:16 EDT 2006 | KEN
Repeatability data please. Please provide source. Can you provide the standard deviation and sample size please. Does this data represent all major angles? Was this data independently verified? Was this data collected using glass parts or p
Electronics Forum | Thu May 18 16:27:53 EDT 2006 | bman
I don't have any experinence with this, but my concern is that you are limiting the amount of contamination your pot can absorb before you ever run a board through. What I mean is that even if you are able to drain all but about a kg of the old sold
