Electronics Forum | Fri Mar 02 14:43:28 EST 2007 | stimpk
Are you using lead free paste also? Are all the other parts on side 1 ROHOS ? etc.. can they handle your leadfree profile. Those need answered 1st. But to answer your question. Yes you can run the BGA side 1st ( hopefully with leadfree paste and ho
Electronics Forum | Fri Mar 02 16:26:57 EST 2007 | Steve
1- Thickness 0.005" 2- I usually reduce 50% of the thermal pad, but it also depend on original size of thermal pad somehow I have to either create window panel or crosshatch otherwise component wil get wimming during reflow. Hope this will help. Reg
Electronics Forum | Thu Mar 15 13:27:45 EDT 2007 | Pete
We had a customer do a similar thing. We notified our customer and educated them on what was happening. We were instructed to try one and report on the results, as the vias were supposed to be filled (and weren't). We pasted and reflowed and as su
Electronics Forum | Mon Mar 19 10:35:44 EDT 2007 | dyoungquist
We use a no-clean lead free paste with our manufacturing floor temp 70-75F and humidity 20%-30%. We have found that if the time from pasting a board until it goes into our reflow oven is less than 4 hours we have no problems. If it is greater than
Electronics Forum | Thu Apr 12 17:34:05 EDT 2007 | carsan
We are running RoHS compliant & non RoHS compliant assemblies. We buy our bare boards from one supplier that only manufactures RoHS compliant boards using a Sn100 finish. Is there any known issues running leaded solder on a Tin finish? Does normal
Electronics Forum | Sat Apr 21 12:06:43 EDT 2007 | Cmiller
I coated three other bare boards on one side this morning from two different suppliers. Two of them had exceptional adhesion and one was so-so. I ran them through the reflow oven, coated them and got the same results on the other side, so it does not
Electronics Forum | Thu May 03 15:48:56 EDT 2007 | geb
Hi, We run a profile check each time we load a recipe. This ensures that the correct settings have been used for the job. It also gives traceability in the event that you need to prove whether or not the oven temperature was the cause for failed pro
Electronics Forum | Tue May 01 06:54:22 EDT 2007 | LC
Hi, We are encountering BGA problems where it dislodge from the board. Some are just by normal handling and some are results from drop test about 15 cm high. We have checked our profile and they are in accordance to the BGA recommended reflow profil
Electronics Forum | Thu May 10 08:09:52 EDT 2007 | davef
There is no standard for time above liquidus. It is described rather broadly by the solder paste supplier. Reflow Zone: If the temperature is too high, boards may char or burn. If the temperature is too low, cold and grainy solder joints will resul
Electronics Forum | Fri May 18 07:50:05 EDT 2007 | georgeiii
Hi All! I have a reflow owen Heller 1800W. I have a problem with it - din't work a cooling zone. There isn't radiator - can anybody send me a photo of this radiator and where I can find it ? Pump is not connected - I don't have a electric schematic f
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