Electronics Forum | Wed Dec 06 23:54:24 EST 2006 | valuems
Think you will find every mpm is operating on dos base software, just in the last 2 years have they got software with windows base. The mouse is related to the version of software, and the old software requires only one model of mouse. Give up tryi
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
Electronics Forum | Fri Dec 08 10:24:11 EST 2006 | pjc
The Speedline Technologies- Electrovert AquaStorm 200 is one machine that can do the trick. You'll need the Chemical Isolation option for the RMA flux and you'll need a cleaning chemistry like what Zestron and Kyzen have. Yes, hi-density boards with
Electronics Forum | Thu Dec 07 14:28:25 EST 2006 | russ
Bad design if you have to have a perfect 1206 part. you will always have a lift of some sort when reflow soldering. Solder is 3 dimensional, therefore you cannot get any underneath component, thus eliminating the automated SMT process. Cannot glue
Electronics Forum | Mon Dec 11 06:29:04 EST 2006 | bwet
See before cversus after pics on BGA pad repair here: http://solder.net/services/services_pad-repair.asp The "how to" instructions for traces (and pads) is here: http://solder.net/solderingtips/PadandTrace_Repair_Solder_Tip12.wmv The skill level
Electronics Forum | Sun Dec 17 18:13:13 EST 2006 | bigdaddysoy9
GLOBAL MEMORY > ALTER MEMORY > MC_READONLY > MC_READONLY [AXIS-ERROR] > ID_MC_READONLY_AXIS_AREA, Then select Axes #9. If you make the changes here, then hit "update", the changes will take effect immediately. Then you can play around and figure out
Electronics Forum | Fri Dec 08 21:23:16 EST 2006 | Harsha
I am seeing a problem of flux droping on the PCBA during reflow. This is a pb free process and I am using KOKI pb free paste with 8 zone (and some 9 zone) reflow ovens. Line throughput is about 10,000 boards/24 hours. I suspect that the exhaust is no
Electronics Forum | Sat Dec 09 12:19:28 EST 2006 | patrickbruneel
To all Techneters, Here�s a last chance to support the exempt request for lead in solders, Link to the publication and supporting documentation: http://tinyurl.com/y3p2dc Follow link below to support the exempt, John (RoHSUSA) made it very simpl
