Electronics Forum | Thu Jun 25 14:45:55 EDT 1998 | Chrys
| I have a single-sided board with test vias that pass through the board. The test vias are pasted and reflowed with the SMT components on the top side. When the boards are wavesoldered, the solder coverage on the vias is spotty. Some will sold
Electronics Forum | Fri Aug 17 06:40:27 EDT 2001 | nifhail
Thanx Dave/Hussman.. We normally store our solder paste in the refrigerator at 0-10 Deg C as per what the supplier recommanded. Our floor temperature is controlled at 22 +/- 5 Deg C and Humidity is at 55 +/- 5%. Recently we have customer asking fo
Electronics Forum | Mon Mar 25 15:51:04 EST 2002 | davef
ASQC re-numbered the once free (taxpayer sponsored development) MIL-STD-105 as ASQ-Z1.4, slapped their own cover on it, and now charge $40 or $50 for the same document! The standards are identical, so see if you can get one of the old �MIL-STD's� and
Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan
Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op
Electronics Forum | Thu Jul 18 17:29:18 EDT 2002 | pjc
Forget what the machine's max. placement cycle rate is spec'd for. For each board you assemble time the actual placement rate. To do this start the stop watch the instant the camera is positioned over the first fiducial on the first board, then stop
Electronics Forum | Tue Apr 29 14:13:52 EDT 2003 | stefwitt
My opinion to hold on to your machines was based on the current market situation. First of all, I don�t believe that a customer with ten boards will go to China for prototype production. Truth is, that the remaining market here is the prototyping mar
Electronics Forum | Fri Jun 01 22:49:50 EDT 2007 | mika
These ones from ALTERA the QFFP-304 0.5mm weight: 32gr. used to give us a really headache in the past. Not only soldering issue:s but also the placement in x-y-theta! The stencil thickness of ours is 0.13mm and because of ohter compomponent packages,
Electronics Forum | Tue Jan 11 12:13:16 EST 2011 | methos1979
Fortunately for me, we do not use Repair Plus so I can't comment on how well that works with the newest software. I have been thinking of doing the html saving though so my engineering and management team, especially those located off-site, can revi
Electronics Forum | Sat Jan 16 02:43:21 EST 1999 | Earl Moon
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Mon May 28 07:30:52 EDT 2001 | bobwillis
Here is a draft visual inspection guide for underfill, please pass this on to the relevant people for any comments or suggestions. I am currently working on the pictures to go with the reference guide. Flip Chip/uBGA Underfill Visual Standards The
