Electronics Forum | Thu May 27 19:00:37 EDT 2010 | emrtech
not just speed, looking to reduce down time on having to re-do boards from bad stencil screening. also, the accuracy of placing solder paste down on PCB's. why would you want an employee spending so much time aligning fiducial marks from panel to pan
Electronics Forum | Mon May 31 11:04:06 EDT 2010 | aj
Hi Manuel, Do you not have a fine pitch placer?if not may be you need to slow down the placement speed on the QFN - I would imagine you would get a lot of fails trying to use the vision to pick up the component lands. We place thousands of QFNs and
Electronics Forum | Thu Jun 10 16:51:01 EDT 2010 | daxman
Hi Manuel, We've been placing QFN's with our CP6's for a long time now. We use vision type 10 just like you describe. I wouldn't bother with front lighting & trying to pick up the leads. Inspecting the leads doesn't provide better accuracy. I would
Electronics Forum | Thu Jul 01 15:12:16 EDT 2010 | siddharth
Thanks to all for their inputs. @Hexielectronics, I am now trying to assemble the board by attaching it to a frame and removing the frame while waving it. I plan to put the boards back on the frame after the board cools down. Could you explain more
Electronics Forum | Thu Jun 24 04:06:33 EDT 2010 | yesobamaa
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Electronics Forum | Wed Jul 14 13:50:11 EDT 2010 | swag
I can't offer much advice on acceptible rates or #'s. From a process standpoint, most of your bridging or insufficient originates in your printer. Look into buying dedicated tooling specifically designed for the build. We use "h-towers" on all hig
Electronics Forum | Tue Jul 20 15:10:00 EDT 2010 | vetteboy86
Recently we have expereinced solder issues with our reflow process. The issue is random and doesn't effect every assembly. I'm seeing extreme solder wicking, no solder flow onto the pads, only onto the leads of the components. I have tried to hand
Electronics Forum | Mon Aug 09 12:46:59 EDT 2010 | ppcbs
Try tinning pads with a high pH water soluble flux like Kester 2331-ZX or Alpha Metals 3355-HB is what we use. It will remove the contamination quick;y without having to scrape with a blade. If you have a large number of bare boards you can run them
Electronics Forum | Sat Aug 07 09:32:54 EDT 2010 | scotceltic
We have a Large LGA package (40mm X 40mm) that we are trying to process on a double-sided assembly. problem is the only space we have for it is on 1st side processing side. Therefore we have worries about falling off in the oven during the 2nd side
Electronics Forum | Sat Aug 21 02:16:42 EDT 2010 | isd_jwendell
I do not have a QSP-2, but build boards where others have done the layout. Some have not included fiducials, and I am left finding other things. Some boards have complete tenting over the vias, so not all PTH pads will work. Drill holes are not as ac
