Electronics Forum: had (Page 585 of 728)

Re: all powerfull UP78..or is it..?

Electronics Forum | Sun May 02 11:53:43 EDT 1999 | Chrys Shea

| | Ok folk's has anyone used Alpha Metal's UP78 solder paste ? | | | | Our place is looking to move to that as the way to go, getting rid of the Hereaus 362's and Alpha 737's of the current set up. | | | | My question's are really : | | how is the

Re: Why are squares better than round ones?(and a update on my lil' nightmare)

Electronics Forum | Wed Apr 28 11:16:45 EDT 1999 | Steve Gregory

Hello all, I read about Steve's headache a few articles back and I'm really interested by his tip. However, I'm still wondering why square apertures release solder paste better than round ones. For the same volume of paste, the surface area of th

Re: 1 mil = ?? inches - why don't we all use the same thing ?

Electronics Forum | Mon Sep 20 04:50:24 EDT 1999 | Brian

| | | | | | | | I am not familiar with the "mil" metric. How many inches is in 1 mil? | | | | | | | | | | | | | | | | ...or 10 mil? | | | | | | | | | | | | | | | | | | | | | | | 1 mil= .001 inches | | | | | | | 10 mil= .010 inches | | | | | | | A

Re: VOC Free Flux

Electronics Forum | Fri May 14 16:08:38 EDT 1999 | Chrys Shea

| | | | | I am looking for anyone who has converted over to VOC Free flux. I need some info on any problems, etc. that you might have had. | | | | | | | | | | Please E-mail me at wes.ruggles@vickers-systems.com or call at (513) 494-5229 | | | | | |

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian

| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a

Re: Soldering to Gold

Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon

| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,

Re: Solder Beading Solder Balling

Electronics Forum | Fri Aug 06 06:13:37 EDT 1999 | Wolfgang Busko

| | | | | | | | | | | | | | | | | | Hello, | | | | | If you are using no-clean and they are entrapped in the flux it is also IPC accepted but i havent found a customer yet who agrees with that. Im sure you have checked your profile. I had the same

Re: Micro-BGA soldering

Electronics Forum | Thu Jul 29 11:34:27 EDT 1999 | Justin Medernach

| | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | 12BGA per assembly | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | Pads .014inch | | | | | | Vias within footprint .020inch | | |

Re: Micro-BGA soldering

Electronics Forum | Thu Jul 29 15:29:30 EDT 1999 | Earl Moon

| | | | | | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | | | | | 12BGA per assembly | | | | | | | | | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | | | | | Pads .014inch | | | | | | | Vias within footprint .02

Re: Dilbert-Like Episodes in Manufacturing... (i need to vent...)

Electronics Forum | Fri Jun 04 15:43:06 EDT 1999 | JohnW

| | Any of you Process/Manufacturing Engineers, techs, etc..or those of you who 'have a clue' about this stuff been victimized by (clueless and uneducated) Manufacturing Supervisors and (clueless and uneducated) Managers who blame EVERYTHING on YOU,


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