Electronics Forum | Thu Mar 25 08:25:20 EST 2004 | Just another guy with Trouble
I need a source to get several thousand SMT ICs re-tined, does anyone know of anyone that can do this for us. the parts are in tape and reel and will need to be repackaged also. We are in a bind the part itself is an end of life component and these w
Electronics Forum | Thu Apr 15 16:07:37 EDT 2004 | barry
Hi there all, we are having problems with 2 qfp devices. grainy poorly reflowed solder joints. One 100 pin .5mm pitch, and one 64 pin .5 mm pitch . Both of these devices have a thermo pad on the back of them (pad area soldered to back of device)which
Electronics Forum | Thu Jun 17 07:04:03 EDT 2004 | davef
It sounds like the parts are not soldering properly [have poor solderability]. This probably due to corroded nickel underplate caused by: * Nickel that oxidized, while awaiting overplating * Poor quality tin overplate, allowing nickel to oxidize aft
Electronics Forum | Wed Jul 07 13:37:56 EDT 2004 | mark
Not sure if this helps but found this site that outlines % of N2 against O2 ppm levels. You need 99.99% N2 purity for http://www.tkb-4u.com/articles/consumables/whatisnitrogen/whatisnitrogen.php Most customers we have worked with in the past run an
Electronics Forum | Thu Jul 15 22:03:07 EDT 2004 | KEN
In no particular order: Will the failed joints wet when touched with an iron + flux? Is there flux surrounding the joint (post reflow). If no, you may be baking it out premateurely. Is this assembly wave soldered? Where is defect discovered in yo
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Wed Aug 18 10:34:35 EDT 2004 | russ
We do this every day, We print the bottom side, then the top, and have a tool that presses the connector on. We then process the board down the line. The only tricky thing is keeping fingers out of paste. Fortunately this is a single sided board.
Electronics Forum | Tue Aug 24 15:05:39 EDT 2004 | Dreamsniper
There is danger in doing this based on theory. Chances of the solder joints becoming cold or having poor wetting due to the fact that during the first run all the flux vehicles had evaporated and with the second run they're no longer present to help
Electronics Forum | Fri Sep 10 17:32:59 EDT 2004 | Yngwie
We have recently faced lifted lead problem that happened on our 20 mil pitch QFP. We have infact pushed it back to the incoming quality, but still I have a few questions to bring up : 1) what is the typical coplanarity tolerance that ICs' manufactur
Electronics Forum | Thu Sep 23 13:14:22 EDT 2004 | Bob R.
We're just getting started in lead free, but the solder balling and poor wetting sounds like what we saw in some early experiments where we were investigating whether we needed nitrogen. Without nitrogen inerting we got just the kind of things you'v
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