Electronics Forum | Thu Apr 17 14:01:26 EDT 2014 | hegemon
And digging a bit further, are the opens at the device level (all the solder on PWB pad, none on device pad) or at the PWB (similar to pillow defect?) After answering that, I would start thinking about(in this order)paste print quality and consisten
Electronics Forum | Fri May 30 20:03:14 EDT 2014 | hegemon
Starting with the manufacturers layout is a good start. Tilted parts, bad solder joints, sounds like a wetting issue and the board or the parts. Insufficient solder sounds like the printing process needs some attention. We have used this part in th
Electronics Forum | Thu Oct 30 23:39:10 EDT 2014 | beilimanu
No paper thing, while I can make some suggestions based on my experience. what is the size of your via? If it's smaller than dia0.4mm, in PCB production process it should be filled by soldermask. So my suggestion is design it to be full filled by SM
Electronics Forum | Fri Mar 06 12:02:36 EST 2015 | saoasasd
So far we have tried diferent date codes, solder pastes and PCBA models (same component used in different projects). We have also sent some components for plating analysis and we are waiting the LAB feedback. Additionally, we have tried components wi
Electronics Forum | Fri Oct 23 12:48:08 EDT 2015 | pjchonis
WE offer Kolb MultiEx N7, a broadband pH neutral cleaning solution that can be used in an ultrasonic cleaner (Concentrate dilution ratio of 1:6). The MultiEx N7 is rated for cleaning solder paste, flux, colophonium and suited for stencils, PCBs, and
Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch
Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC
Electronics Forum | Thu Jan 05 13:41:16 EST 2017 | huske
You have too much paste; I have used a lot of test points/spring contacts, etc. A single pin placement, especially one like this one that has a high lead to pad ratio, meaning 80% or more of the pad is covered by that single flat “lead” on the botto
Electronics Forum | Wed Mar 15 08:47:50 EDT 2017 | emeto
From what I know, you should follow IPC standard for the class assembly that you are building. From your post somebody mentioned something somewhere - doesn't make it official information. I would not be worried about having voids, but what is their
Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics
The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi
Electronics Forum | Sun Mar 25 08:45:00 EDT 2018 | jacobidiego
Normally some random components of size 0604 or below and may be due to a thermal mass being close like a transformer or AC electrolytic caps. We tried changing fan speed, but this will change the thermal profile and avoid the thermal mass from bein
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