Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Fri Sep 21 14:03:45 EDT 2001 | jschake
I have observed solder balling for all aperture sizes tested. Solder balling levels appear to be better correlated against the amount of solder paste that is underneath the 0201 component terminations after placement rather than comparing this to th
Electronics Forum | Thu Oct 11 17:44:30 EDT 2001 | aaelect
OK, OK. 672 ball BGA. The pcbs are PC Card bus size and are .015 thick. There are 3 on a panel with about 1/2" between and rails. The aluminum plates are about 3" by 7". There are 3 cutouts which allow for the parts from either side to protrude du
Electronics Forum | Tue Oct 16 06:08:12 EDT 2001 | wbu
Hi Dave, tweaking, oh yes, we did like it to have that job done and not have people sitting around waiting for work or beeing able to deliver on schedule. Nonconformity report, ...ummmmh, weren�t that big that we thought we needed it, actually the t
Electronics Forum | Tue Oct 16 07:00:06 EDT 2001 | genglish
Hi all, I have a problem and would gratefully take on suggestions, firstly let me explain the situation: We are currently screen printing adhesive, using a method similar to DEKs 'Pump Print', The adhesive we are currently using is supplied from Alp
Electronics Forum | Wed Oct 17 13:02:41 EDT 2001 | Yngwie
We are running Clean process. solder beadings were found after the wash process. Weird eh!! It's true.. Details: 1)wash pressure ? No shadowing effects from high profile component. It also happened on the component's body of the 1210 & 0402 caps whi
Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Wed Nov 21 05:06:31 EST 2001 | frha
Thanks Mr Parker! I understand that the basic "demming-wheel" needs to be on place first. My contract manufacturers list ALL adjustments, failures etc during the production, and we also discuss the statistics (pareto) and corrective actions for all d
Electronics Forum | Fri Nov 30 17:33:12 EST 2001 | slthomas
After saying for years that we'd never do two-sided assembly, the powers that be are not only saying we will, but they're threatening to throw an out of house design at us...no frame (it's a PCI card with a couple of dinky breakaway tabs), no tooling
Electronics Forum | Thu Dec 06 15:09:14 EST 2001 | smtspecialist
Thanks for the info, Of course the first thing to do was to look with my supplier, but the problem was that it's a special relay, custom made from a design created 10 years ago. Two years ago that company went BK and we had to order a whole bunch t
