Electronics Forum | Wed Jun 22 02:30:33 EDT 2011 | boardhouse
if its a RoHs Assembly they should be using an FR4 material designed with higher TD to handle higher Assembly temps. 370HR,IT158, IT180, 4000-29 just to name a few that would be suitable. Standard FR4 material is not designed to handle the higher as
Electronics Forum | Fri Jun 24 09:32:53 EDT 2011 | kahrpr
Looking at the appearance of pads and solder joint is pretty subjective. Especially lead free people are all over the map on the physical appearance of pads and joints. The true test is solderabilty testing, weather it’s just looking for good wetti
Electronics Forum | Wed Jul 20 08:40:27 EDT 2011 | mosborne1
Umar - This is usually seen when the lead frame in the die attach is cut with a diamond saw instead of a lasar. We have seen this problem years ago from HP 7 segment displays. If you have Enviromental box (tenney box) you can temp cycle them from 0 d
Electronics Forum | Thu Aug 25 21:26:27 EDT 2011 | leadthree
Solderability could be an issue. We usually buy the IC and stock it for up to 9 month. This time the ICs was from a broker and the datecode was not the latest. This said, we use already a solder paste that contains watersoluble flux, which is suppos
Electronics Forum | Fri Sep 16 08:01:06 EDT 2011 | davef
We see no advantage to extending the toe-end of pads. Hell, 90 percent of the time the numb-end of the toe of the component lead isn't plated. So, it doesn't take solder. Further, solder on the toe adds little, if anything to the strength on the sold
Electronics Forum | Mon Oct 03 16:02:55 EDT 2011 | artposada
The machine does not have pre-heating feature. I'm soldering a six-up panel...I've tried putting them a an oven and letting them soak for 20 mins or so at a low temp. But by the time I placed the panel in the machine and manually fluxed the top sid
Electronics Forum | Tue Jan 03 11:01:19 EST 2012 | julie331975
We are working with .065" thick metal core PCB's. I have a couple boards that are in need of rework. The components we are placing are similar to a SOJ package with a solder pad underneath the component. We are also using a lead free process. I have
Electronics Forum | Thu Mar 15 06:01:24 EDT 2012 | andyhat
We run Mascots for leaded assembly on 15 stations for 20 product types in around 2500 variations...the system works brillianlty for us, but we experience programs going out of sequence for no apparent reason spontaneously - literally, an operator can
Electronics Forum | Thu Mar 29 02:46:25 EDT 2012 | johndoe0222
My company is doing a project with a lot of QFN. The question that we are not sure is how to properly solder a QFN on a PCB. QA says The alignment tab on the side of the QFN should have a physical solder from the board, like a leaded chip. After refl
Electronics Forum | Tue Apr 03 08:38:34 EDT 2012 | tombstonesmt
Yesterday morning wasn't the first time I noticed this condition. We remove the dross from the pot twice a day and once a week we remove the pump assembly and it still produces this type of dross. I googled this situation and some factors of this par
