Electronics Forum | Tue Aug 10 15:28:54 EDT 2004 | Shean Dalton
Because the HASL process most deal with bare metals, HASL flux residues are generally more active than solder paste residues. Typically a Rosin Active (RA) flux is used in the HASL process. These flux residues should be removed from the bare board
Electronics Forum | Thu Aug 05 05:00:34 EDT 2004 | Bryan
In my normal Pb process,we 've a station names "Remove the solder balls and clean the board",I think we'll also have such a station in our Pb-free process. Bryan
Electronics Forum | Wed Aug 04 18:43:42 EDT 2004 | davef
We agree with you. Since when do failures ask themselves about the process used to attach them to the board, before failing. Smack your colleagues for us!!!
Electronics Forum | Thu Aug 05 13:51:18 EDT 2004 | davef
You need to have 1 thou of copper. If don't moisture absorbed by the board will out-gas through the plating.
Electronics Forum | Tue Aug 10 12:51:59 EDT 2004 | robert.barr@xensor.com
WE CAN'T SEEM TO FIND A BOARD HOUSE THAT CAN SEPERATE OUR PCB ASSEMBLIES WITHOUT CRACKING COMPONENTS. BEEN THROUGH TWELVE OF THEM. IS IT OUR PROBLEM OR IS ANYBODY ELSE HAVING ANY TROUBLE WITH THIS.
Electronics Forum | Thu Aug 12 14:59:50 EDT 2004 | davef
Russ: Immersion gold [imm Au] is "soft" and it's "gold", but it is NOT "soft gold". Here's the question for your board house: If imm Au is "soft gold" and imm Au self-limits
Electronics Forum | Thu Aug 19 09:38:24 EDT 2004 | russ
We use a locally made fixture that uses tooling pins and a mating block to place the connector onto/into. We then use a toggle clamp to push the connector onto the board. We had to make no adjustments to stencil for our application. Russ
Electronics Forum | Fri Aug 20 10:34:21 EDT 2004 | John S
Can anyone recommend a manufacturer of prototype flex circuits that could deliver a 4 layer board in 2-3 days? Thanks John S
Electronics Forum | Sat Aug 28 11:03:44 EDT 2004 | mariels
We are currently designing a multi-layer board using a BGA with a pitch of 1mm. Need to find out what hole/pad size via and if they should be plated holes? Thanks
Electronics Forum | Tue Aug 31 07:51:45 EDT 2004 | Six Sigma QE
Our supplier is suggesting the 'removal and replacement' of programmable IC components to reduce cost. The removed components will be placed on other boards as well. Is there a risk in reworking programable IC components. Thank you.
