Electronics Forum: applied (Page 60 of 188)

Land Grid Array (LGA) Rework

Electronics Forum | Mon Aug 25 16:48:14 EDT 2008 | petep

Any tips out there for effective LGA rework? How is solder best re-applied? Can these parts be sent out like BGA's for "re-balling"? Like all of you, we build, profile place and solder for reliability, but the time will come when one of these co

Bottom side adheasive

Electronics Forum | Tue Dec 09 14:03:05 EST 2008 | pms

Steve, We use stencils for applying adhesives to PCB's, with our DEK Proflow system. Works well for us. Once in a while, we have to manually add adhesive to a specific location depending on the component height. Vary rare though. You shouldn't have

BGA failure at Functional Test

Electronics Forum | Thu Jan 08 10:56:13 EST 2009 | aj

Hi, Is there any PTH Assembly after reflow, we found cracked joints on some BGAs which was caused by operators ing Oupin connectors which were a tight fit. This caused the PCB to flex hence cracking joints. One way of checking for this during test

Is This Corrosion?

Electronics Forum | Wed Jan 21 13:48:16 EST 2009 | smt_guy

hi davef, good idea! run one sample and see waht happens with the solderability. yeah we received them good and just happened after 45 days in our stock room. I suspect that during the HAL process some parts of the vias with epoxy fillings were no

how to measure Adhesive strength

Electronics Forum | Tue May 12 07:26:16 EDT 2009 | emmanueldavid

Jorge, The basic thumb rule to measure Adhesive Strength remains as bonded Chips at Post Reflow should not move around or misplace when Your Thumb Finger try to do so which called as Thumb Force Test. However as Dave stated, there are various Stre

Is IPC-9701 apply to QFN package?

Electronics Forum | Sun May 24 21:12:59 EDT 2009 | keith78

I have a problem recently to qualify QFN package on solder joint reliability. The pcb thickness stated in IPC-9701 is 2.35mm but from the in-house test, QFN surface mount on 2.35mm thickness PCB board have a short cycle to failure due to higher CTE m

BGA ball vs land design problem??

Electronics Forum | Thu Jun 04 20:06:30 EDT 2009 | davef

Since posting the above comment extolling the virtues of NSMD pads and disparaging SMD pads, we've learned that the points apply to all array devices, but in spite of that some designers of fine pitch [eg, 0.4, 0.5mm pitch] array devices choose SMD w

ESD considerations during Conformal Coating?

Electronics Forum | Thu May 28 16:10:07 EDT 2009 | operator

How does one keep a pcb safe from ESD when applying an aerosol conformal coating on a flat surface? Even if you had an ESD mat to place the pcb on it would quickly be coated. The only thing I can think of is an ionizer. Does not the aerosol create a

ESD considerations during Conformal Coating?

Electronics Forum | Thu May 28 23:03:15 EDT 2009 | davef

10kv on the surface of the board. To avoid this charge: * Use an electric paint sprayer to apply liquid -base conformal coating * Purchase a metal nozzle for an electric spray gun so that it can be connected to ground * Use a nuclear ionizer where th

Ecofree 303 conductive and corrosive?

Electronics Forum | Mon Aug 24 04:46:54 EDT 2009 | joannetjy

Hi Radek, Thanks for your reply. I use this flux with manual soldering process for the product. Is this flux suitable for manual soldering? or it is only for wave soldering? I have sent the board for analysis, and the report shown that the white res


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