Electronics Forum | Fri Sep 03 08:19:44 EDT 2010 | rway
Agreed, but his fiducials aren't working so he may have to resort to something a little bigger that returns a more consistent pattern. You are correct, this will provide less accuracy than his fiducials but will save him the expense of cleaning his
Electronics Forum | Wed Jul 03 10:37:41 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Wed Sep 20 16:15:53 EDT 2017 | davef
Some requirements to consider are: * Humidity and temperature controlled according to J-STD-001 * Electro-static discharge (ESD) control program according to ANSI/ESD-S-20.20. * Soldering technicians are trained and certified according to J-STD-0
Electronics Forum | Mon Dec 25 08:43:35 EST 2017 | arjunkolavara
Hi , We are having Pin hole issues on the passive locations in the board after the SMT reflow process. Details: PCB surface Finish : ENIG . Solder paste : Alpha OM338 – M13 / Indium SMQ92J Location : Its Random and more on passive components. {
Electronics Forum | Wed Jan 15 11:18:51 EST 2020 | avillaro2020
Hi Evtimov, Thanks again! The solder wicking/open solder joint is not actually gross rejection, it is only a few and appeared random (difficult to trend the location of the opens), what is perflexing is that i have this 1 or 2 open solder joints sur
Electronics Forum | Thu Aug 06 09:51:20 EDT 1998 | Bob Willis
This text may be of interest to any one with tin lead spots Guide to Solder Spots - A New Plague in Manufacture ? So what are solder spots ? They appear to be the next big problem in modern reflow assembly in fact in any process that involves solder
Electronics Forum | Mon Oct 25 15:45:11 EDT 1999 | Dave F
Joe: Lemme see, you�re talking about controlling your manufacturing process within 4.6 defects per 100 opportunities or a 4,600 dpmo rate, a cumulative 99.95 acceptance rate, or a �2 sigma process, right? So, it�s fairly basic stuff, eh? First, yo
Electronics Forum | Fri Dec 22 16:04:26 EST 2006 | mika
Hi, This Not so easy as one wuold think. Has the thermal pad of yours vias? How many? What's the via's dia? What is the pcb thickness? If the the pcb has a "ground layer" connected (vias) to the pcb thermal pad, it could sometimes be a little bit tri
Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F
| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect
Electronics Forum | Tue Mar 23 23:17:03 EST 1999 | Chris G.
| Are there many of you who are soldering through hole parts in your surface mount reflow oven? How repeatable is the process? Do you need to touch up a lot after reflow? We don't do long runs maybe 200, 300 boards max. Can you just screen print
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