Electronics Forum | Fri Jul 11 11:14:30 EDT 2008 | bkreiman
I agree that it should be a non-issue considering that the primary purpose of a solder joint is to electrically connect the lead to the board. However, there are some here that think these leads should be touched up because this part is a power jack
Electronics Forum | Tue Jul 15 16:30:57 EDT 2008 | boardhouse
Hi Aj, Recommended Immersion gold thickness would be 3-5 Micro inches over 140 -200 micro inches of Nickel. Thicker Immersion gold than 5 micro inches can cause solder joint embrittlement. Gold readily dissolves in molten solder and will be present
Electronics Forum | Fri Jul 11 09:37:16 EDT 2008 | realchunks
BGAs are actually easy, but proper stencil design, solder paste placement and oven profiles are a must. Especially oven profiles as this is your only indication that the inner balls have reached proper temp, since you cannot visually tell. If you g
Electronics Forum | Sun Jul 13 10:33:08 EDT 2008 | mpolak
Hello, Recently I have change our profiles. After I profile one board it look really good, within the paste spec. But I have noticed when board leaves the reflow zone and enters the cooling zone it looks like popcorn effect some components jumping o
Electronics Forum | Mon Jul 14 12:55:07 EDT 2008 | arminski
I have a board with the above problem from our PCB supplier. After they applied the solder mask and run the PCB's to HASL process, the solder mask bubbled on one side of the PCB making the solder mask thickness higher and PCB looking awkward. They s
Electronics Forum | Wed Jul 16 10:31:29 EDT 2008 | vms
I would recommend a mpm, some one else would say a dek and some one else would come up with some thing else. Both dek and mpm printers will take the 29x29 stencils. And you have more money than you need for one of them. Shop around and then go and
Electronics Forum | Thu Jul 17 15:12:18 EDT 2008 | slthomas
To quote a regular here, "Are you sure your washer is set up correctly?" :P He's a WS junkie. This is a really common problem and is discussed here often. Mid chip solder balls (solder beads) are almost always the result of too much paste being dep
Electronics Forum | Tue Jul 15 18:05:48 EDT 2008 | arminski
How many times do you measure your oven's profile? I have seen companies running a thermal profile prior to every run of their products into the oven. But if you are in a low to medium volume - high mix category what is the best frequency of measurem
Electronics Forum | Thu Jul 17 08:28:20 EDT 2008 | jdumont
With our last two ovens (Heller and now BTU) spanning the past 7 or 8 years I did it once a month and have never seen any issues. Reflow ovens these days with PID controllers know exactly what they are doing inside well before you run a profiler thro
Electronics Forum | Thu Jul 17 14:30:42 EDT 2008 | tommyg_fla
1500 lbs) vary by a couple of degrees) were standard. I thought that flux penetration into PTH barrel and solder pot immersion depth and solder pot parallelism would be also critical factors. We are using the ECD WaveRider to measure the implied sold
