Electronics Forum | Wed Nov 28 17:02:28 EST 2007 | joeherz
We use TraCon's TraBond 2112 for staking applications where larger gaps are involved. It is formulated for PCB staking applications. The material is very low sag and high viscosity. It's 2part and comes in handy bi-paks. Work life is 20-30min.
Electronics Forum | Wed Nov 21 10:15:53 EST 2007 | davef
On one hand, maybe National Aeronautics and Space Administration standards are a good starting point to establish standards for ruggedized manufacturing practice. Look here: http://workmanship.nasa.gov/wkstds_nasa.jsp On the other hand, as you say
Electronics Forum | Fri Nov 23 12:50:27 EST 2007 | bbarton
Do you have any input as to the vibrations seen on the end-use device? Types of device(s) that have solder joint failure? How many thermal cycles the PCB goes through before failure? There are several areas in production of the board that could be th
Electronics Forum | Wed Nov 21 15:37:46 EST 2007 | afm
We have been looking for an old machine (budget issues), and we have foud Juki 570L and Quad IVc to be around same cost. I have found some comments on the forum for the Quad (good in general), but not too much for the Juki. Beside the expected issues
Electronics Forum | Wed Nov 28 16:15:17 EST 2007 | jmelson
One more concern is "consumables" like nozzles, chuck jaws, etc. On some machines these parts wear rapidly and need frequent replacement, or are very easily damaged and need replacement after even the most minor crashes like a dropped component layi
Electronics Forum | Fri Nov 23 18:16:08 EST 2007 | g2garyg2
I may be able to help but would need to understasnd more about your application. The rating on the diode laser can directly effect its ability to refelct or penetrate the solder, but I would lnot to rule out beam placement at the joint either. If yo
Electronics Forum | Fri Nov 23 16:09:01 EST 2007 | davef
We're not real clear about what you're trying to discuss, because most capacitors are packaged in epoxy with a solderable termination on each end. But lets throw a couple of ideas at the wall and see what sticks. If this epoxy is: * From the capaci
Electronics Forum | Tue Nov 27 14:56:33 EST 2007 | jaimebc
Shy, What is your current method of applying adhesive? If the terminals of the component that has adhesive are not wetting ( or not forming a solder joint I think we are talking about ) after reflow, then you must be applying too much adhesive. As
Electronics Forum | Wed Nov 28 01:07:36 EST 2007 | shy
is there any standard gap between the terminal and pad if we place the glue? SMT-4 mention as per what you understand which is using glue at SMT without solder paste and run at wave solder for the solder paste at the terminal. Glue supplier recomm
Electronics Forum | Thu Nov 29 22:38:05 EST 2007 | shy
Hi Dback, Yes, i'm open "dog bone" aperture for my chip component. this is to prevent solder ball issue. For fine pitch i'm opening square with full length and half width to prevent bridging. Btw, if "dog bone" is not for chip component, what is your
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