Electronics Forum: has (Page 595 of 1227)

Siemens siplace for high mix/medium to low volume

Electronics Forum | Wed Jun 10 14:22:47 EDT 1998 | Rob Reilly

I am currently in the process of trying to justify new equipment in my factory. I currently have Siemens siplace 15 series machines. I don't feel thins equipment is right for high mix/ medium to low Volume. I am running up against a in house conti

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Sat Jun 13 00:33:41 EDT 1998 | Scott McKee

| Hidee Ho Brian! | Just like the other Steve, we just bought a SPM too. Our is brand new, and it's a SPM-AV (has vision). The other option we have is a automatic underside stencil cleaner. | We're a contract assembler as well, just starti

Re: Splicing tape for 8,12, and 16mm component tapes

Electronics Forum | Wed Jun 10 19:53:01 EDT 1998 | Joe Herz

| The Tesa company delivers Splice Tape for 8mm, | 12mm and 16mm. Also special splice tape for 8mm | paper tape and some splice tools as well. | Siemens uses for large tape a 'staple' but might | be patented and then cannot be used outside Siemens.

Re: Splicing tape for 8,12, and 16mm component tapes

Electronics Forum | Wed Jul 01 10:32:01 EDT 1998 | Eric Klaver

| How can I reach Tesa? I've tried to find a website that contains some useful information but no luck. | By the way, Siemens has stonewalled me regarding their tool/material. Seems to be reserved for Siemens | users exclusively. Joe, The address

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Sat Jun 27 20:16:20 EDT 1998 | Chris Haynes

| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F SRT makes

Re: BGA Pad Dressing After Removal Method / Where's The Beef?

Electronics Forum | Mon Jun 08 21:08:52 EDT 1998 | Dave F

| If any one needs a procedure for rework and repair of BGA there is a document on my Web Site to download www.bobwillis.co.uk | | What methods do people use to dress pads after removing and before replacing the BGA? | | We use solder wick and a sold

Re: BGA Pad Dressing After Removal Method

Electronics Forum | Wed Jun 03 18:19:45 EDT 1998 | Earl Moon

| What methods do people use to dress pads after removing and before replacing the BGA? | We use solder wick and a soldering iron, focusing on not "dragging" the wick across vias. This is laborous and booring. Who has a better way? | Dave F Dave, Wha

Re: Double sided smt

Electronics Forum | Sun Jun 07 06:05:37 EDT 1998 | Bob Willis

| Can anyone tell me if there is a reference for smt component height specs on the bottom side of a board, which will also go through wave soldering. A current design I am reviewing has tant caps(7343) and a crystal on the back side. Should I only b

SMT Pick and Place

Electronics Forum | Thu May 28 10:57:10 EDT 1998 | John

Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. Here's what we are in the market for: Low/Mid volume 3,000+cph machine that can handle high job fle

Re: SMT Pick and Place

Electronics Forum | Sun Jun 07 01:35:22 EDT 1998 | Franco Dav�

| Our company is currently looking to implement a SMT production line. What I am looking for is feedback on people's experiences with various machines. | Here's what we are in the market for: | Low/Mid volume 3,000+cph machine that can handle high j


has searches for Companies, Equipment, Machines, Suppliers & Information