Electronics Forum | Mon Jun 25 10:06:35 EDT 2001 | dave f
are you saying to put a gap in between the board and the stencil? i have been fighting solder balls for a while now. sometimes i can fix them by placement "z" in the machines other times i can't. what should i have my oven profile look like? i have m
Electronics Forum | Mon Jun 25 20:58:07 EDT 2001 | davef
Wolfgang: Is your company going-out of business? What "future is canceled"? What lights are being turned-out and doors being locked? Is there a fat lady tuning-up her vocal cords, too? [If so, sympathy.] Another "Dave F", now that�s something t
Electronics Forum | Tue Jun 26 09:37:28 EDT 2001 | Steve Vargas
We are interested in doing some further studies on our cleaning process, particularly with respect to how well we can clean underneath low profile components. As an SMT subcontractor, we'd ideally like to qualify our chemistry/cleaning process to cer
Electronics Forum | Wed Jul 04 14:22:51 EDT 2001 | davef
I just rooted through an analysis that we did five or six years ago [so current it aint] and finally found the goods. We talked to Vitronic, Heller, Electrovert, IR, and Conceptronic. Only Electrovert had a 2.75" throat [rail to top of board cleara
Electronics Forum | Mon Aug 06 10:33:32 EDT 2001 | Hussman
Hi Pete, Wow, I figured you'd have tons of answers to this one. Anyway, call the vendor of the adhesive you are using and see if they have a cleaner for their adhesive. Most do now. Just make sure the SMT pads and vias do not have any adhesive on
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Thu Jan 20 02:36:29 EST 2000 | erico
Hi wolfgang,Dave & PC: What I facing are: 1. The component lie flat on the board but only one side can get solder.The pad is ok, problem is with the chip. 2.I desolder the chip and go to view it under microscope and found that there is a line near t
Electronics Forum | Thu Jan 20 11:20:28 EST 2000 | Brian W.
It sounds like what you are seeing is leaching of the end cap. You need to check the manufacturer's spec. Many components have terminal barriers, which get a solder plating. Sometimes this plating process is not done well, and the solder plating le
Electronics Forum | Sun Jan 23 03:23:09 EST 2000 | Rob Steltman
Hi We use a U-channel piece of high temperature silicon which is just pushed over the gold tabs before the soldering process. The silicon can be used over and over again. The advantages are that there is no mask on the board during the SMT process a
Electronics Forum | Tue Jan 11 15:33:31 EST 2000 | Prawin Paulraj
Hello, I would like to request some information regarding the interfacing of SMT machines. i am of the understanding that it involves some interfaces like SMEMA 1.1,1.2 and SMPI. I would like to know more about the interfacing of machines using these
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