Electronics Forum | Fri Jan 14 16:21:42 EST 2000 | Dave Chapman
We are having mid chip solder balls on chips and resistors. Seeing the problem on 80% of the assemblies we run. Anywhere from 1 to six of the balls per board. We have slowed the oven down, increased the pressure on the screenprinter to get less paste
Electronics Forum | Thu Jul 17 15:12:18 EDT 2008 | slthomas
To quote a regular here, "Are you sure your washer is set up correctly?" :P He's a WS junkie. This is a really common problem and is discussed here often. Mid chip solder balls (solder beads) are almost always the result of too much paste being dep
Electronics Forum | Wed Aug 09 22:00:44 EDT 2000 | Dave F
Hey Charles!!! Where in earthly heaven did you get a TO263 with "large solderable tab (approx 8mm square) on the back and 5 leads"? All the TO263s that�ve reached-up and smacked me have been "TO220s" with a modified tab and three leads that are f
Electronics Forum | Wed Aug 15 19:04:26 EDT 2001 | mparker
Viewing a blade on its own merits may give you subjective results. Are you asking about metal or rubber squeegees? You really need to examine the print quality before you decide if a blade is worth using. If you are getting the right paste deposit vo
Electronics Forum | Tue Apr 13 19:14:25 EDT 2004 | Dreamsniper
Hi DaveF, To explain. The BGA that we have is from Motorola. The solder balls of these BGA's are Eutectic Solder and processed using a NC flux (as per info from supplier). So this means that the BGA pad and solder connections had NC flux process. W
Electronics Forum | Thu Aug 29 20:15:26 EDT 2002 | davef
That you are getting BIG gobs of solder on the pads indicates that your print / paste process is probably OK. Sounds like someone did something bad to the OSP. Tell us about: * Supplier and brand of OSP that your board fabricator used. * Number of
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Mon Jul 26 12:55:08 EDT 1999 | Rob Fischer
I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effective
Electronics Forum | Thu Sep 10 17:10:00 EDT 1998 | Steve Gregory
Hi Tim, 8-mil huh? Boy, that's getting down there...you know, placing 8-mil is one thing, but printing solder paste on 8-mil pitch is another. Most of the time when I've seen 8-mil pitch on a board it's been attached with hot-bar...but I guess
Electronics Forum | Wed Sep 19 19:43:13 EDT 2001 | stefo
Hi Jeff, I'm sorry my post isn't related to 0201's, but I thought I'd ask the expert since we have access to you... You may know this already, but it's a buyers market out there for used equipment. We currently have a 265 MK-1 that works fine, but
